High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM‐SL/D)

2001 ◽  
Vol 18 (3) ◽  
pp. 36-42 ◽  
Author(s):  
Eric Beyne ◽  
Rita Van Hoof ◽  
Tomas Webers ◽  
Steven Brebels ◽  
Stéphanie Rossi ◽  
...  
Author(s):  
E. A. Soliman ◽  
S. Brebels ◽  
E. Beyne ◽  
P. Delmotte ◽  
G. Vandenbosch

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