Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards

Circuit World ◽  
1992 ◽  
Vol 19 (1) ◽  
pp. 53-62
Author(s):  
W.A. Fairweather
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Circuit Boards ◽  
Copper Plating ◽  
Multilayer Circuit Boards

Electroless Copper Plating Process by Applying Alternating One-Side Air Stirring Method for High-Aspect-Ratio Through-Holes

2017 ◽  
Vol 164 (12) ◽  
pp. D771-D777 ◽  
Author(s):  
H. Kanemoto ◽  
T. Kawamura ◽  
H. Suzuki ◽  
T. Miyazaki ◽  
H. Mozumi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroplating High Aspect Ratio Through Holes in Thick Printed Circuit Boards

1990 ◽  
Vol 68 (2) ◽  
pp. 50-54 ◽  
Author(s):  
G. L. Fisher ◽  
W. Sonnenberg ◽  
J. Bladon ◽  
R. Bernards
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

Limits of copper plating in high aspect ratio microvias

Circuit World ◽  
1999 ◽  
Vol 25 (2) ◽  
pp. 35-40 ◽  
Author(s):  
Steve Castaldi ◽  
Dennis Fritz ◽  
Ron Schaeffer
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Plating

scholarly journals System for Inspecting Defects on the Inner Wall of High-aspect-ratio Through-holes in Printed Circuit Boards.

1995 ◽  
Vol 61 (1) ◽  
pp. 80-84
Author(s):  
Yasuhiko HARA ◽  
Kiyoshi NUMATA ◽  
Satoru SHINADA ◽  
Ryuichi INOUE ◽  
Hiroshi IWATA
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit
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