scholarly journals Low energy dissipation readout of single-molecule ferroelectronic states by a spin-Seebeck signal

2020 ◽  
Vol 2 (4) ◽  
Author(s):  
Hua-Hua Fu ◽  
Dan-Dan Wu ◽  
Gui-Fang Du ◽  
Qing-Bo Liu ◽  
Menghao Wu
PLoS ONE ◽  
2008 ◽  
Vol 3 (9) ◽  
pp. e3134 ◽  
Author(s):  
Lu-Ning Liu ◽  
Abdalmohsen T. Elmalk ◽  
Thijs J. Aartsma ◽  
Jean-Claude Thomas ◽  
Gerda E. M. Lamers ◽  
...  

2019 ◽  
Vol 6 (4) ◽  
pp. 181965 ◽  
Author(s):  
Jia Suizi ◽  
Cao Wanlin ◽  
Liu Zibin

This study developed a low-energy consumption composite wall structure constructed with a pre-fabricated lightweight steel frame that is suitable for houses in villages and towns and evaluated its anti-seismic performance. A low-reversed cyclic-loading test was conducted on four full-scale pre-fabricated structure specimens, including a lightweight, concrete-filled steel tube (CFST) column frame specimen (abbreviated as SFCF), a lightweight CFST column frame composite wall specimen (abbreviated as SFCFW), an H-steel column frame specimen (abbreviated as HSCF) and an H-steel column frame composite wall specimen (abbreviated as HSCFW). The failure characteristics, hysteretic behaviour, strength, rigidity, ductility and energy dissipation capacity of each specimen were compared and analysed. The results demonstrated that the pre-fabricated, double L-shaped beam–column joint with a stiffener rib which was proposed in this study worked reliably and exhibited good anti-seismic performance. The yield, ultimate and frame yield loads of the specimen SFCFW were 1.72, 1.80 and 2.03 times higher than those of specimen SFCF. The yield load, ultimate load and frame yield loads of specimen HSCFW were 1.27, 1.68 and 1.82 times higher than those of specimen HSCF. This indicates that the embedded composite wall contributed significantly to the horizontal bearing capacities of the SFCF and HSCF specimens. The embedded composite wall was divided into multiple strip-shaped composite panels during failure and achieved a stable support for the frame in the later stages of elastoplastic deformation. The horizontal strips of the tongue-and-groove connection between the strip-shaped composite panels produced reciprocating bite displacements, and ultimately improved the structure's energy dissipation capacity significantly.


Langmuir ◽  
2010 ◽  
Vol 26 (24) ◽  
pp. 18926-18937 ◽  
Author(s):  
Yewang Su ◽  
Baohua Ji ◽  
Yonggang Huang ◽  
Keh-chih Hwang

2017 ◽  
Vol 114 (7) ◽  
pp. 1474-1479 ◽  
Author(s):  
Jean-Nicolas Longchamp ◽  
Stephan Rauschenbach ◽  
Sabine Abb ◽  
Conrad Escher ◽  
Tatiana Latychevskaia ◽  
...  

Imaging single proteins has been a long-standing ambition for advancing various fields in natural science, as for instance structural biology, biophysics, and molecular nanotechnology. In particular, revealing the distinct conformations of an individual protein is of utmost importance. Here, we show the imaging of individual proteins and protein complexes by low-energy electron holography. Samples of individual proteins and protein complexes on ultraclean freestanding graphene were prepared by soft-landing electrospray ion beam deposition, which allows chemical- and conformational-specific selection and gentle deposition. Low-energy electrons do not induce radiation damage, which enables acquiring subnanometer resolution images of individual proteins (cytochrome C and BSA) as well as of protein complexes (hemoglobin), which are not the result of an averaging process.


2018 ◽  
Vol 2018 ◽  
pp. 1-8 ◽  
Author(s):  
Alfredo D. Bobadilla ◽  
Leonidas E. Ocola ◽  
Anirudha V. Sumant ◽  
Michael Kaminski ◽  
Jorge M. Seminario

Microelectronic fabrication of Si typically involves high-temperature or high-energy processes. For instance, wafer fabrication, transistor fabrication, and silicidation are all above 500°C. Contrary to that tradition, we believe low-energy processes constitute a better alternative to enable the industrial application of single-molecule devices based on 2D materials. The present work addresses the postsynthesis processing of graphene at unconventional low temperature, low energy, and low pressure in the poly methyl-methacrylate- (PMMA-) assisted transfer of graphene to oxide wafer, in the electron-beam lithography with PMMA, and in the plasma patterning of graphene with a PMMA ribbon mask. During the exposure to the oxygen plasma, unprotected areas of graphene are converted to graphene oxide. The exposure time required to produce the ribbon patterns on graphene is 2 minutes. We produce graphene ribbon patterns with ∼50 nm width and integrate them into solid state and liquid gated transistor devices.


2006 ◽  
Vol 15 (5) ◽  
pp. 1493-1498 ◽  
Author(s):  
Kanjuro Makihara ◽  
Junjiro Onoda ◽  
Takeya Miyakawa

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