scholarly journals Direction of the microjet produced by the collapse of a cavitation bubble located in a corner of a wall and a free surface

2021 ◽  
Vol 6 (8) ◽  
Author(s):  
Akihito Kiyama ◽  
Takaaki Shimazaki ◽  
José Manuel Gordillo ◽  
Yoshiyuki Tagawa
Keyword(s):  
Free Surface ◽  
Cavitation Bubble

Investigation of a cavitation bubble between a rigid boundary and a free surface

2007 ◽  
Vol 102 (9) ◽  
pp. 094904 ◽  
Author(s):  
Peter Gregorčič ◽  
Rok Petkovšek ◽  
Janez Možina
Keyword(s):  
Free Surface ◽  
Cavitation Bubble ◽  
Rigid Boundary

scholarly journals A note on the instantaneous streamlines, pathlines and pressure contours for a cavitation bubble near a boundary

1984 ◽  
Vol 26 (1) ◽  
pp. 31-44 ◽  
Author(s):  
P. Cerone ◽  
J. R. Blake
Keyword(s):  
Free Surface ◽  
Stagnation Point ◽  
Cavitation Bubble ◽  
Maximum Pressure ◽  
Rigid Boundary ◽  
Initial Distance ◽  
Bubble Pressure ◽  
Collapse Phase

AbstractInstantaneous streamlines, particle pathlines and pressure contours for a cavitation bubble in the vicinity of a free surface and near a rigid boundary are obtained. During the collapse phase of a bubble near a free surface, the streamlines show the existence of a stagnation point between the bubble and the free surface which occurs at a different location from the point of maximum pressure. This phenomenon exists when the initial distance of the bubble is sufficiently close to the free surface for the bubble and free surface to move in opposite directions during collapse of the bubble. Pressure calculations during the collapse of a cavitation bubble near a rigid boundary show that the maximum pressure is substantially larger than the equivalent Rayleigh bubble of the same volume.

Dynamics of a Pulsating Bubble Beneath a Free Surface

2002 ◽  
Author(s):  
M. T. Shervani-Tabar
Keyword(s):  
Integral Equation ◽  
Free Surface ◽  
Boundary Integral Equation ◽  
Cavitation Bubble ◽  
Constant Pressure ◽  
Integral Equation Method ◽  
Ideal Gas ◽  
Boundary Integral ◽  
Equation Method ◽  
Bubble Collapse

In this paper Dynamics of a rebounding cavitation bubble beneath a free surface is carried out by using Boundary Integral Equation Method. The bubble contains a mixture of constant pressure vapour and ideal gas. Results show that the free surface is pushed up during the growth of the bubble and collapses with the bubble collapse. It is found that the free surface rebounds in synchronisation with the rebound of the bubble.

scholarly journals A note on the impulse due to a vapour bubble near a boundary

1982 ◽  
Vol 23 (4) ◽  
pp. 383-393 ◽  
Author(s):  
J. R. Blake ◽  
P. Cerone
Keyword(s):  
Free Surface ◽  
Point Source ◽  
Cavitation Bubble ◽  
High Speed ◽  
Liquid Jet ◽  
Vapour Bubble ◽  
Rigid Boundary ◽  
Two Fluids ◽  
Collapse Phase

AbstractAn expression for the impluse due to a vapour (cavitation) bubble is obtained in terms of an integral over a nearby boundary. Examples for a point source near a free surface, rigid boundary, inertial boundary and a fluid of different density are considered. It appears that the sign of the impluse determines the direction a cavitation bubble will migrate and the direction of the high speed liquid jet during the collapse phase. The theory may explain recent observations on buoyant bubbles near an interface between two fluids of different densities.

scholarly journals Numerical Simulation for Cavitation Bubble Near Free Surface and Rigid Boundary

2015 ◽  
Vol 56 (4) ◽  
pp. 534-538 ◽  
Author(s):  
Kanae Oguchi ◽  
Manabu Enoki ◽  
Naoya Hirata
Keyword(s):  
Numerical Simulation ◽  
Free Surface ◽  
Cavitation Bubble ◽  
Rigid Boundary

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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