Inertial mode interactions in a rotating tilted cylindrical annulus with free surface

2020 ◽  
Vol 5 (9) ◽  
Author(s):  
Wenchao Xu ◽  
Uwe Harlander
Keyword(s):  
Free Surface ◽  
Cylindrical Annulus ◽  
Mode Interactions

The motion of a fluid due to a moving source of heat at the boundary

1967 ◽  
Vol 29 (1) ◽  
pp. 137-150 ◽  
Author(s):  
A. Davey
Keyword(s):  
Thermal Expansion ◽  
Angular Momentum ◽  
Free Surface ◽  
Thermal Field ◽  
Vertical Component ◽  
Phase Lag ◽  
Two Dimensional ◽  
Cylindrical Annulus ◽  
Net Flux ◽  
Direction Opposite

Experiments performed by Fultz et al. (1959) and Stern (1959) indicate that if a flame is rotated around the bottom exterior of a pan or of a circular cylindrical annulus containing water then the fluid acquires a net vertical component of angular momentum in a direction opposite to that of the flame's motion. Stern gave an analysis showing how fluid, bounded by two horizontal plates subjected to small two-dimensional sinusoidal travelling temperature perturbations, could acquire and maintain such momentum. An assumption in Stern's analysis was that the density variations were constant between the plates. Here we shall examine the importance of the relaxation of this assumption. Also, another model, in which the upper surface of the fluid is free, is analysed, because this model conforms more closely with the experiments of Fultz et al. and Stern.For the problem of flow between two plates we shall show that there is a net flux of momentum in the direction opposite to the motion of the thermal field for all frequencies thereof. The same result holds in the case with a free surface when conditions are comparable with those in the experiments.In both problems the phase lag of the thermal expansion wave with height produces a skewed thermal field. This field is the most important mechanism in producing velocity correlations. It is due to these correlations and the associated Reynolds stress that the fluid acquires its momentum.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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