scholarly journals Role of fluttering dislocations in the thermal interface resistance between a silicon crystal and plastic solid He4

2018 ◽  
Vol 97 (1) ◽  
Author(s):  
Jay Amrit ◽  
Aymeric Ramiere ◽  
Sebastian Volz
Keyword(s):  
Silicon Crystal ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance

Flame propagation in nano-aluminum–water (nAl–H2O) mixtures: The role of thermal interface resistance

2019 ◽  
Vol 201 ◽  
pp. 160-169
Author(s):  
Murali Gopal Muraleedharan ◽  
Umesh Unnikrishnan ◽  
Asegun Henry ◽  
Vigor Yang
Keyword(s):  
Flame Propagation ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance

Characterization of a Liquid-Metal Micro Droplets Thermal Interface Material

2010 ◽  
Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Applied Load ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance ◽  
Droplet Array

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.

Design and Validation of a High-Temperature Thermal Interface Resistance Measurement System

2016 ◽  
Vol 8 (3) ◽  
Author(s):  
Menglong Hao ◽  
Kimberly R. Saviers ◽  
Timothy S. Fisher
Keyword(s):  
Surface Roughness ◽  
Measurement Accuracy ◽  
Heat Losses ◽  
Thermal Interface Material ◽  
Interface Temperature ◽  
Test Apparatus ◽  
Graphite Foil ◽  
Thermal Interface ◽  
Interface Resistance ◽  
Thermal Interface Resistance

In order to measure thermal interface resistance (TIR) at temperatures up to 700 °C, a test apparatus based on two copper 1D reference bars has been developed. Design details are presented with an emphasis on how the system minimizes the adverse effects of heat losses by convection and radiation on measurement accuracy. Profilometer measurements of the contacting surface are presented to characterize surface roughness and flatness. A Monte Carlo method is applied to quantify experimental uncertainties, resulting in a standard deviation of thermal resistance as low as 2.5 mm2 K/W at 700 °C. In addition, cyclic measurements of a standard thermal interface material (TIM) sample (graphite foil) are presented up to an interface temperature of 400 °C. The interface resistance results range between approximately 40 and 100 mm2 K/W. Further, a bare Cu–Cu interface is evaluated at several interface temperatures up to 700 °C.

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