scholarly journals Temperature evolution of superparamagnetic clusters in single-crystalLa0.85Sr0.15CoO3characterized by nonlinear magnetic ac response and neutron depolarization

2015 ◽  
Vol 92 (1) ◽  
Author(s):  
A. V. Lazuta ◽  
V. A. Ryzhov ◽  
V. V. Runov ◽  
V. P. Khavronin ◽  
V. V. Deriglazov
Keyword(s):  
Temperature Evolution ◽  
Superparamagnetic Clusters ◽  
Ac Response ◽  
Neutron Depolarization

DOMAIN STRUCTURE STUDIES OF HARDMAGNETIC MATERIALS BY NEUTRON DEPOLARIZATION

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-665-C8-666 ◽  
Author(s):  
G. Badurek ◽  
R. Giersig ◽  
R. Grössinger ◽  
A. Veider ◽  
H. Weinfurter
Keyword(s):  
Domain Structure ◽  
Neutron Depolarization

Temperature Evolution of Evacuated Tube Adsorbtion Bed Heated by Solar Radiation

2014 ◽  
Author(s):  
Chun-Xu Du ◽  
Zhong-Xian Yuan ◽  
Xiao-Huang Hou ◽  
Feng Xin ◽  
Dong-Dong Gao ◽  
...  
Keyword(s):  
Solar Radiation ◽  
Temperature Evolution ◽  
Evacuated Tube

Temperature evolution of the local atomic structure in oxygen isotope substituted Pr 0.525 La 0.175 Ca 0.3 MnO 3

2002 ◽  
Vol 74 (0) ◽  
pp. s892-s894 ◽  
Author(s):  
M. Gutmann ◽  
E.S. Bo?in ◽  
S.J.L. Billinge ◽  
N.A. Babushkina ◽  
L.M. Belova ◽  
...  
Keyword(s):  
Oxygen Isotope ◽  
Atomic Structure ◽  
Local Atomic Structure ◽  
Temperature Evolution

Neutron-depolarization analysis and small-angle neutron-scattering studies of the reentrant spin glassNi77Mn23

1993 ◽  
Vol 48 (9) ◽  
pp. 6074-6086 ◽  
Author(s):  
T. Sato ◽  
T. Ando ◽  
T. Watanabe ◽  
S. Itoh ◽  
Y. Endoh ◽  
...  
Keyword(s):  
Neutron Scattering ◽  
Small Angle ◽  
Small Angle Neutron Scattering ◽  
Neutron Depolarization

Ac response of a coupled double quantum dot

2005 ◽  
Vol 14 (10) ◽  
pp. 2093-2099 ◽  
Author(s):  
Xu Jie ◽  
W. Z Shangguan ◽  
Zhan Shi-Chang
Keyword(s):  
Quantum Dot ◽  
Double Quantum ◽  
Double Quantum Dot ◽  
Ac Response

scholarly journals Comparison of Thermal Stress during Short-Circuit in Different Types of 1.2 kV SiC Transistors Based on Experiments and Simulations

2017 ◽  
Vol 897 ◽  
pp. 595-598
Author(s):  
Diane Perle Sadik ◽  
Jang Kwon Lim ◽  
Juan Colmenares ◽  
Mietek Bakowski ◽  
Hans Peter Nee
Keyword(s):  
Thermal Stress ◽  
Short Circuit ◽  
Thermal Simulation ◽  
Temperature Evolution ◽  
Power Devices ◽  
Different Types ◽  
Transient Thermal

The temperature evolution during a short-circuit in the die of three different Silicon Carbide1200-V power devices is presented. A transient thermal simulation was performed based on the reconstructedstructure of commercially available devices. The location of the hottest point in the device iscompared. Finally, the analysis supports the necessity to turn off short-circuit events rapidly in orderto protect the device after a fault.

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