scholarly journals Evidence for temperature-dependent spin diffusion as a mechanism of intrinsic flux noise in SQUIDs

2014 ◽  
Vol 89 (1) ◽  
Author(s):  
T. Lanting ◽  
M. H. Amin ◽  
A. J. Berkley ◽  
C. Rich ◽  
S.-F. Chen ◽  
...  
Keyword(s):  
Spin Diffusion ◽  
Temperature Dependent ◽  
Intrinsic Flux ◽  
Flux Noise

Dependence of SQUID Intrinsic Flux Noise on Stewart–McCumber Parameter $\beta_{c}$ of Josephson Junction

2016 ◽  
Vol 26 (5) ◽  
pp. 1-5 ◽  
Author(s):  
Hai Wang ◽  
Yongliang Wang ◽  
Xiangyan Kong ◽  
Guofeng Zhang ◽  
Yi Zhang ◽  
...  
Keyword(s):  
Josephson Junction ◽  
Intrinsic Flux ◽  
Flux Noise

Observation of distinct, temperature dependent flux noise near bicrystal grain boundaries in YBa2Cu3O7−x films

2000 ◽  
Vol 333 (3-4) ◽  
pp. 133-138 ◽  
Author(s):  
K.R Bukh ◽  
C.S Jacobsen ◽  
J.Bindslev Hansen ◽  
Y.Q Shen ◽  
T Holst
Keyword(s):  
Grain Boundaries ◽  
Temperature Dependent ◽  
Flux Noise ◽  
Distinct Temperature

Intrinsic flux noise of high-Tc RF-SQUID in the dissipative mode

1992 ◽  
Vol 201 (1-2) ◽  
pp. 50-52 ◽  
Author(s):  
Xiaohui Wang ◽  
Jin Xin ◽  
Xixian Yao
Keyword(s):  
High Tc ◽  
Intrinsic Flux ◽  
Flux Noise ◽  
Rf Squid

(111) Monocrystalline Nickel Films

1972 ◽  
Vol 30 ◽  
pp. 512-513
Author(s):  
T.E. Pratt ◽  
R.W. Vook
Keyword(s):  
Film Thickness ◽  
Deposition Rate ◽  
Room Temperature ◽  
Narrow Range ◽  
High Vacuum ◽  
Residual Pressure ◽  
Temperature Dependent ◽  
Deposition Parameters ◽  
Transmission Electron ◽  
Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

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