Pressure-constrained deformation and superior strength: Compressed graphite versus diamond

2013 ◽  
Vol 88 (10) ◽  
Author(s):  
Wei Zhou ◽  
Hong Sun ◽  
Yi Zhang ◽  
Changfeng Chen
1982 ◽  
Vol 30 (3) ◽  
pp. 695-709 ◽  
Author(s):  
U.F Kocks ◽  
H Chandra

1991 ◽  
Vol 226 ◽  
Author(s):  
M.A. Korhonen ◽  
P. Bergesen ◽  
Che-Yu Li

AbstractThe yield strength of metallic thin films bonded to hard substrates can be significantly higher than is customary for bulk samples of the same metal. This is related to the constrained nature of the deformation. The constrained deformation, as well as the commonly observed crystallographic texture of thin films, places restrictive conditions on the mechanisms of deformation that produce stress relaxation. In narrow aluminum based metallizations used as interconnects in large scale integrated circuits thermal stress induced voiding provides an effective means for stress relaxation. For these interconnects, the stress state is tensile after excursions to higher temperatures; the stresses relax mainly by dislocation glide and grain boundary sliding during the cooldown, while the longer term relaxation is governed by stress-induced voiding and dislocation creep.


2017 ◽  
Vol 114 ◽  
pp. 71-84 ◽  
Author(s):  
Changdong Zhang ◽  
Tingting Liu ◽  
Wenhe Liao ◽  
Tao Yang ◽  
Liyi Jiang

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