scholarly journals Interfacial thermal resistance between carbon nanotubes: Molecular dynamics simulations and analytical thermal modeling

2006 ◽  
Vol 74 (12) ◽  
Author(s):  
Hongliang Zhong ◽  
Jennifer R. Lukes
Keyword(s):  
Carbon Nanotubes ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Molecular Dynamics Simulations ◽  
Thermal Modeling ◽  
Interfacial Thermal Resistance ◽  
Dynamics Simulations

Thermal conductivity and interfacial Thermal Resistance Behavior for the Polyaniline (C3N)– boron carbide (BC3) Heterostructure

2021 ◽  
Author(s):  
Arian Mayelifartash ◽  
Mohammad Ali Abdol ◽  
Sadegh Sadeghzadeh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Boron Carbide ◽  
Molecular Dynamics Simulations ◽  
Thermal Conductance ◽  
Interfacial Thermal Resistance ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
Non Equilibrium

In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the thermal conductance of hybrid formed by polyaniline (C3N) and boron carbide (BC3) in both armchair and zigzag configurations has...

Molecular Dynamics Simulations of Thermal Transport at the Nanoscale Solid-Liquid Interface

2013 ◽  
Vol 291-294 ◽  
pp. 1999-2003 ◽  
Author(s):  
Zhi Hai Kou ◽  
Min Li Bai ◽  
Guo Chang Zhao
Keyword(s):  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Molecular Dynamics Simulations ◽  
Solid Wall ◽  
Liquid Interface ◽  
Heat Fluxes ◽  
Interfacial Thermal Resistance ◽  
Dynamics Simulations ◽  
Solid Liquid Interface ◽  
Solid Liquid

Simulation of nanoscale thermo-fluidic transport has attracted considerable attention in recent years owing to rapid advances in nanoscience and nanotechnology. The three- dimensional molecular dynamics simulations are performed for the system of a liquid layer between two parallel solid walls at different wall temperatures. The solid-solid interaction is modeled by the embedded atom method. The heat flux through the solid-liquid interface is calculated by Green-Kubo method. The effects of interface wettability and wall temperature on the interfacial thermal resistance are also analyzed. It is found that there exist the relatively immobile quasi-crystalline interfacial layers close to each solid wall surface with higher number density and thus higher local thermal conductivity than the corresponding liquid phase. The interfacial thermal resistance length is overestimated by 8.72% to 19.05% for the solid-solid interaction modeled by the Lennard-Jones potential, and underestimated based on heat fluxes calculated by Fourier equation.

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