Electronic transport and consequences for material removal in ultrafast pulsed laser ablation of materials

2004 ◽  
Vol 69 (5) ◽  
Author(s):  
N. M. Bulgakova ◽  
R. Stoian ◽  
A. Rosenfeld ◽  
I. V. Hertel ◽  
E. E. B. Campbell
Keyword(s):  
Laser Ablation ◽  
Electronic Transport ◽  
Material Removal ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation

Comparative Assessment of the Laser-Induced Plasma Micromachining and the Ultrashort Pulsed Laser Ablation Processes

2014 ◽  
Vol 2 (3) ◽  
Author(s):  
Kumar Pallav ◽  
Ishan Saxena ◽  
Kornel F. Ehmann
Keyword(s):  
Laser Ablation ◽  
Material Removal ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Comparative Assessment ◽  
Ablation Process ◽  
Laser Induced Plasma ◽  
Laser Ablation Process ◽  
Matter Interaction ◽  
Ultrashort Pulsed Laser

The ultrashort pulsed laser ablation process is a well-established micromachining process and has been at the center of manufacturing research in the past decade. However, it has its own limitations, primarily due to the involvement of various material-specific laser and machining process parameters. The laser-induced plasma micromachining (LIP-MM) is a novel tool-less and multimaterial selective material removal type of micromachining process. In a manner similar to ultrashort pulsed laser ablation, it also removes material through an ultrashort pulsed laser beam. However, instead of direct laser–matter interaction, it uses the laser beam to generate plasma within a transparent dielectric media that facilitates material removal through plasma–matter interaction and thus circumvents some of the limitations associated with the ultrashort pulsed laser ablation process. This paper presents an experimental investigation on the comparative assessment of the capabilities of the two processes in the machining of microchannels in stainless steel. For this purpose, microchannels were machined by the two processes at similar pulse energy levels and feed-rate values. The comparative assessment was based on the geometric characteristics, material removal rate (MRR), heat-affected zone and shock-affected zone (HAZ, SAZ), and the range of machinable materials.

Observations on the growth of YBa2Cu3O7-δ thin films on MgO by pulsed-laser ablation

1991 ◽  
Vol 49 ◽  
pp. 1068-1069
Author(s):  
M. Grant Norton ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Laser Ablation ◽  
Substrate Surface ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Laser Ablation Process ◽  
Deposition Parameters

Pulsed-laser ablation has been widely used to produce high-quality thin films of YBa2Cu3O7-δ on a range of substrate materials. The nonequilibrium nature of the process allows congruent deposition of oxides with complex stoichiometrics. In the high power density regime produced by the UV excimer lasers the ablated species includes a mixture of neutral atoms, molecules and ions. All these species play an important role in thin-film deposition. However, changes in the deposition parameters have been shown to affect the microstructure of thin YBa2Cu3O7-δ films. The formation of metastable configurations is possible because at the low substrate temperatures used, only shortrange rearrangement on the substrate surface can occur. The parameters associated directly with the laser ablation process, those determining the nature of the process, e g. thermal or nonthermal volatilization, have been classified as ‘primary parameters'. Other parameters may also affect the microstructure of the thin film. In this paper, the effects of these ‘secondary parameters' on the microstructure of YBa2Cu3O7-δ films will be discussed. Examples of 'secondary parameters' include the substrate temperature and the oxygen partial pressure during deposition.

scholarly journals Doping nanoparticles using pulsed laser ablation in a liquid containing the doping agent

2019 ◽  
Vol 1 (10) ◽  
pp. 3963-3972 ◽  
Author(s):  
Arsène Chemin ◽  
Julien Lam ◽  
Gaétan Laurens ◽  
Florian Trichard ◽  
Vincent Motto-Ros ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Doping Agent ◽  
Laser Ablation In Liquids ◽  
Dope Nanoparticles

While doping is crucial for numerous technological applications, its control remains difficult especially when the material is reduced down to the nanometric scale. We suggest a new way to dope nanoparticles using laser ablation in liquids.

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