Photoelectron spectroscopy studies of growth, thermal stability, and alloying for transition metal-tungsten (111) bimetallic systems

2002 ◽  
Vol 65 (7) ◽  
Author(s):  
J. J. Kolodziej ◽  
T. E. Madey ◽  
J. W. Keister ◽  
J. E. Rowe
Keyword(s):  
Thermal Stability ◽  
Transition Metal ◽  
Photoelectron Spectroscopy ◽  
Bimetallic Systems ◽  
Spectroscopy Studies

Photoelectron spectroscopy studies of growth, alloying, and segregation for transition-metal films on tungsten (211)

2000 ◽  
Vol 62 (8) ◽  
pp. 5150-5162 ◽  
Author(s):  
J. J. Kolodziej ◽  
T. E. Madey ◽  
J. W. Keister ◽  
J. E Rowe
Keyword(s):  
Transition Metal ◽  
Photoelectron Spectroscopy ◽  
Metal Films ◽  
Spectroscopy Studies

scholarly journals Improvement of the thermal stability of dendritic silver-coated copper microparticles by surface modification based on molecular self-assembly

2021 ◽  
Vol 8 (1) ◽  
Author(s):  
Tae Hyeong Kim ◽  
Hyeji Kim ◽  
Hyo Jun Jang ◽  
Nara Lee ◽  
Kwang Hyun Nam ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Photoelectron Spectroscopy ◽  
Self Assembly ◽  
Electrically Conductive ◽  
X Ray ◽  
Alkyl Chains ◽  
Conductive Film ◽  
Initial Resistance ◽  
Thermal Stability Of ◽  
Scanning Electron

AbstractIn the study reported herein, silver-coated copper (Ag/Cu) powder was modified with alkanethiols featuring alkyl chains of different lengths, namely butyl, octyl, and dodecyl, to improve its thermal stability. The modification of the Ag/Cu powders with adsorbed alkanethiols was confirmed by scanning electron microscopy with energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Each powder was combined with an epoxy resin to prepare an electrically conductive film. The results confirmed that the thermal stability of the films containing alkanethiol-modified Ag/Cu powders is superior to that of the film containing untreated Ag/Cu powder. The longer the alkyl group in the alkanethiol-modified Ag/Cu powder, the higher the initial resistance of the corresponding electrically conductive film and the lower the increase in resistance induced by heat treatment.

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