scholarly journals Pressure dependence of the superconducting critical temperature ofTl2Ba2Ca2Cu3O10+yandTl2Ba2Ca3Cu4O12+yup to 21 GPa

1996 ◽  
Vol 54 (14) ◽  
pp. 10175-10185 ◽  
Author(s):  
D. Tristan Jover ◽  
R. J. Wijngaarden ◽  
R. Griessen ◽  
E. M. Haines ◽  
J. L. Tallon ◽  
...  
Keyword(s):  
Critical Temperature ◽  
Pressure Dependence

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

2005 ◽  
Author(s):  
X. F. Ang ◽  
G. G. Zhang ◽  
J. Wei ◽  
Z. Chen ◽  
C. C. Wong
Keyword(s):  
Shear Strength ◽  
Critical Temperature ◽  
Pressure Dependence ◽  
Bonding Temperature ◽  
Interfacial Stress ◽  
3D Integration ◽  
Bonding Pressure ◽  
Barrier Films ◽  
Linear Rise ◽  
Temperature And Pressure

Low temperature interconnection is a critical component of 3D integration and packaging technology. In this study, we investigate the characteristics of thermocompression metal bonding using gold stud bumps formed on Si die in the temperature range of 100-300 °C and the pressure range of 200–600 g/bump. We observed a critical bonding temperature below which bonding did not occur and above which shear strength improves linearly with bonding temperature. This critical temperature can be interpreted to be the onset of the break-up of organic barrier films while the linear rise in shear strength can be attributed to the increase in the true bonded area. Above this critical temperature, the tensile strength of the Au-Au bond exhibits a maximum with increasing bonding pressure. This can be related to the pressure dependence of the interfacial stress distribution and its effect on unbonded radius, r. SEM fractographs of the failed surfaces suggest a combination of cohesive and adhesive failures along the bonded interface.

STRAIN-INDUCED ELECTRONIC TOPOLOGICAL TRANSITIONS IN LaSrCuO THIN FILMS

2003 ◽  
Vol 17 (04n06) ◽  
pp. 542-547
Author(s):  
G. G. N. ANGILELLA ◽  
G. BALESTRINO ◽  
P. CERMELLI ◽  
P. PODIO-GUIDUGLI ◽  
A. A. VARLAMOV
Keyword(s):  
Thin Films ◽  
Critical Temperature ◽  
Hydrostatic Pressure ◽  
Band Structure ◽  
Pressure Dependence ◽  
Point Of View ◽  
Ginzburg Landau ◽  
Nonmonotonic Dependence ◽  
Topological Transition ◽  
Epitaxial Strain

We review a Ginzburg-Landau phenomenological model for the dependence of the critical temperature on microscopic strain in tetragonal high-T c cuprates. Such a model is in agreement with the experimental results for LSCO under epitaxial strain, as well as with the hydrostatic pressure dependence of T c in most cuprates. In particular, a nonmonotonic dependence of T c on hydrostatic pressure, as well as on in-plane or apical microstrain, is derived. From a microscopic point of view, such results can be understood as due to the proximity to an electronic topological transition (ETT). In the case of LSCO, we argue that such an ETT can be driven by a strain-induced modification of the band structure, at constant hole content, at variance with a doping-induced ETT, as is usually assumed.

The Effect of Pressure on the Critical Temperature of Four-Component Microemulsioms

1989 ◽  
Vol 177 ◽  
Author(s):  
Jacques Goyette ◽  
T. K. Bose ◽  
J. Thoen ◽  
J. R. Lalanne
Keyword(s):  
Refractive Index ◽  
Critical Temperature ◽  
Correlation Length ◽  
Critical Points ◽  
Pressure Dependence ◽  
Sodium Dodecylsulfate ◽  
Nonlinear Behavior ◽  
Negative Sign ◽  
Effect Of Pressure ◽  
Line Ending

ABSTRACTWe present results for the pressure dependence of the critical temperature (dTc/dP) for several microemulsions of n-dodecane, water, n-pentanol and sodium dodecylsulfate with critical points along a criticial line ending at a critical end point (CEP). The variation of dTc/dP as a function of the water to surfactant ratio X shows a nonlinear behavior, with large changes near the CEP, and similar to the X dependence previously observed for the correlation length amplitude ξo. From the negative sign of dTc/dP we also conclude that a possible anomaly in the density must be opposite to the anomaly recently reported for the refractive index.

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