Effect of impurities on electron motion in two dimensions in a strong magnetic field

1989 ◽  
Vol 40 (18) ◽  
pp. 12126-12132 ◽  
Author(s):  
K. B. Efetov ◽  
V. G. Marikhin
Keyword(s):  
Magnetic Field ◽  
Strong Magnetic Field ◽  
Two Dimensions ◽  
Electron Motion ◽  
Effect Of Impurities

scholarly journals UNSTABLE ELECTROMAGNETIC MODES IN STRONGLY MAGNETIZED PLASMAS

2013 ◽  
Vol 27 (30) ◽  
pp. 1350151
Author(s):  
S. SON ◽  
SUNG JOON MOON
Keyword(s):  
Magnetic Field ◽  
Strong Magnetic Field ◽  
Inertial Confinement Fusion ◽  
Gamma Ray ◽  
Landau Damping ◽  
Magnetized Plasmas ◽  
Inertial Confinement ◽  
Electron Motion ◽  
Confinement Fusion ◽  
Long Time

A theory for instability in the long-time limit, arising from the electron gyro-motion in strongly magnetized plasmas, is presented. The analysis of the electron motion in the presence of a strong magnetic field leads to a theoretical framework similar to that of the Landau damping. Various electromagnetic modes are predicted to be possibly unstable, and the regime where the radiation from this instability would stand out, compared to the incoherent electron–cyclotron radiation, is identified. This instability would be relevant to the inertial confinement fusion and the gamma ray burst.

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

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