scholarly journals Temperature, stress, and structural-relaxation dependence of the magnetostriction in (Co0.94/BFe0.06)75/BSi15B10glasses

1987 ◽  
Vol 35 (10) ◽  
pp. 5066-5071 ◽  
Author(s):  
J. M. Barandiarán ◽  
A. Hernando ◽  
V. Madurga ◽  
O. V. Nielsen ◽  
M. Vázquez ◽  
...  
Keyword(s):  
Temperature Stress ◽  
Structural Relaxation ◽  
Relaxation Dependence

Study of Structural Relaxation in Amorphous Ni-Pd-P Alloys by Means of X-Ray Diffraction*

1988 ◽  
Vol 157 (Part_1) ◽  
pp. 91-95 ◽  
Author(s):  
Eugen Bühler ◽  
Peter Lamparter ◽  
Siegfried Steeb
Keyword(s):  
Structural Relaxation ◽  
X Ray Diffraction ◽  
X Ray

Assessment of wheat (Triticum aestivum L.) genotypes for high temperature stress tolerance using physico-chemical analysis

2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi
Keyword(s):  
Triticum Aestivum ◽  
High Temperature ◽  
Chemical Analysis ◽  
Stress Tolerance ◽  
Temperature Stress ◽  
Triticum Aestivum L ◽  
High Temperature Stress ◽  
Physico Chemical

Genome-wide identification and analysis of maize PAL gene family and its expression profile in response to high-temperature stress

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
Gene Family ◽  
Temperature Stress ◽  
Expression Profile ◽  
High Temperature Stress ◽  
Genome Wide

Improved Burn-In Stress Methodology for Stress Uniformity

2018 ◽  
Author(s):  
Jungsuk Ko ◽  
Hoonchang yang ◽  
Hyungchae Jeon ◽  
Gyuyoung Nam ◽  
Youngseok Ryu ◽  
...  
Keyword(s):  
Temperature Stress ◽  
Stress Condition ◽  
Temperature Deviation ◽  
Stress Effects ◽  
Hot Temperature ◽  
Production Environments ◽  
Stress Environment ◽  
The Stability ◽  
Stress Uniformity ◽  
Stress Voltage

Abstract The necessity of hot temperature stress is widely recognized as the initial stress methodology to maintain the stability of products from infant defects in device [1, 2]. However, hot temperature stress has a disadvantage in terms of stress uniformity because temperature variation according to stress environment such as chamber, board, and tester accelerates different stress effects per chips. In addition, this stress condition can cause serious reliability problem in the mass production environments. Therefore, the stress temperature should be lowered to minimize the temperature deviation due to the production environments. The reduction of stress temperature cause the lack of stress amount, so optimized stress voltage and time to maintain the stress condition is required. In this study, various stress voltage and time with decreasing temperature were evaluated in consideration of lifetime that unit elements such transistors and capacitors did not degrade by any stress conditions. In addition, it was confirmed that stress uniformity can be improved in the stress condition obtained by the evaluation. Furthermore, the enhanced initial failure screen ability was proven with mass evaluations.

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