Substrate effects on the electronic structure of metal overlayers—an XPS study of polymer-metal interfaces

1979 ◽  
Vol 20 (12) ◽  
pp. 4853-4858 ◽  
Author(s):  
James M. Burkstrand
Keyword(s):  
Electronic Structure ◽  
Substrate Effects ◽  
Structure Of Metal ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Xps Study ◽  
Metal Overlayers

Chemical and electronic structure of conjugated polymer/metal interfaces relevant in LED devices

1995 ◽  
Author(s):  
M. Fahlman ◽  
Giovanna Iucci ◽  
William R. Salaneck ◽  
Jean-Luc Bredas
Keyword(s):  
Electronic Structure ◽  
Conjugated Polymer ◽  
Polymer Metal ◽  
Metal Interfaces

Electronic structure of metal overlayers on rhodium

1983 ◽  
Vol 28 (6) ◽  
pp. 3092-3099 ◽  
Author(s):  
Peter J. Feibelman ◽  
D. R. Hamann
Keyword(s):  
Electronic Structure ◽  
Structure Of Metal ◽  
Metal Overlayers

Model Compound Approach for Polymer-Metal InterFaces: ESCA Studies

1984 ◽  
Vol 40 ◽  
Author(s):  
P. N. Sanda ◽  
J. W. Bartha ◽  
B. D. Silverman ◽  
P. S. Ho ◽  
A. R. Rossi
Keyword(s):  
Model Compound ◽  
Amino Groups ◽  
Ether Linkage ◽  
Cu Films ◽  
Polymer Metal ◽  
Terminal Amino ◽  
Metal Interfaces ◽  
Imide Group

AbstractESCA studies of two molecules which are similar in structure to the PMDA and ODA constituents of the PMDA-ODA polyimide monomer are discussed. Their interaction with in-situ evaporated Cr and Cu films are compared. The PMDA model compound interacts with Cr through the imide group, while very little interaction is observed with Cu. The ODA model compound (oxydianiline) interacts with Cr via the ether linkage and the terminal amino groups, whereas very little interaction is observed with Cu.

Charactervation of Adhesion in Thin-Film Materials by the Blister Test

1992 ◽  
Vol 276 ◽  
Author(s):  
Y Z. Chu ◽  
H. S. Jeong ◽  
R. C. White ◽  
C. J. Durning
Keyword(s):  
Fluid Pressure ◽  
Structural Features ◽  
Adhesion Energy ◽  
Pressure Data ◽  
Blister Test ◽  
Constant Rate ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Peel Tests ◽  
Microscopic Dynamic

ABSTRACTIn this work a blister test is applied to study the adhesion of thin films to substrates. In the blister test one injects a fluid at constant rate at the interface between the substrate and an overlayer to create a “blister”. The fluid pressure is measured as function of time. An analysis gives a reliable way of calculating the adhesion energy Ga. from the time-dependent pressure data. The method was applied to a variety of systems including polymer/polymer, polymer/silicon and polymer/metal interfaces. The results show that the test is very sensitive and is able to determine small adhesion energies inaccessible in conventional peel tests. This work demonstrates that the blister test provides a means of relating the mechanical strength of an interface to its microscopic dynamic and structural features.

Studies on polymer-metal interfaces

Polymer ◽  
1999 ◽  
Vol 40 (14) ◽  
pp. 3989-3994 ◽  
Author(s):  
Dong Ha Kim ◽  
Won Ho Jo
Keyword(s):  
Polymer Metal ◽  
Metal Interfaces
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