Density response function and the dynamic structure factor of thin metal films: Nonlocal effects

1979 ◽  
Vol 19 (4) ◽  
pp. 1689-1705 ◽  
Author(s):  
Adolfo Eguiluz
Keyword(s):  
Response Function ◽  
Structure Factor ◽  
Dynamic Structure ◽  
Metal Films ◽  
Dynamic Structure Factor ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Nonlocal Effects ◽  
Density Response Function ◽  
Density Response

scholarly journals Dynamic Structure Factor: An Introduction

1993 ◽  
Vol 48 (1-2) ◽  
pp. 233-242 ◽  
Author(s):  
K. Sturm
Keyword(s):  
Dielectric Function ◽  
Response Function ◽  
Structure Factor ◽  
Density Functional ◽  
Dynamic Structure ◽  
High Energy ◽  
Dynamic Structure Factor ◽  
X Rays ◽  
Density Response Function ◽  
Density Response

Abstract The doubly differential cross-section for weak inelastic scattering of waves or particles by manybody systems is derived in Born approximation and expressed in terms of the dynamic structure factor according to van Hove. The application of this very general scheme to scattering of neutrons, x-rays and high-energy electrons is discussed briefly. The dynamic structure factor, which is the space and time Fourier transform of the density-density correlation function, is a property of the many-body system independent of the external probe and carries information on the excitation spectrum of the system. The relation of the electronic structure factor to the density-density response function defined in linear-response theory is shown using the fluctuation-dissipation theorem. This is important for calculations, since the response function can be calculated approximately from the independent-particle response function in self-consistent field approximations, such as the random-phase approximation or the local-density approximation of the density functional theory. Since the density-density response function also determines the dielectric function, the dynamic structure can be expressed by the dielectric function.

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

scholarly journals Single Chain Dynamic Structure Factor of Linear Polymers in an All-Polymer Nano-Composite

2016 ◽  
Vol 49 (6) ◽  
pp. 2354-2364 ◽  
Author(s):  
Arantxa Arbe ◽  
José A. Pomposo ◽  
Isabel Asenjo-Sanz ◽  
Debsindhu Bhowmik ◽  
Oxana Ivanova ◽  
...  
Keyword(s):  
Structure Factor ◽  
Dynamic Structure ◽  
Dynamic Structure Factor ◽  
Linear Polymers ◽  
Single Chain ◽  
Nano Composite ◽  
Chain Dynamic

On the electrocatalytic symbiotic synergism between Pt, Ni and Al in plasma vapour deposited PtxNiyAlz thin metal films for water electrolysis

2021 ◽  
Vol 494 ◽  
pp. 229344
Author(s):  
Roelof J. Kriek ◽  
Liesel A. van Heerden ◽  
Anzel Falch ◽  
Malcolm I. Gillespie ◽  
Alaa Y. Faid ◽  
...  
Keyword(s):  
Water Electrolysis ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films
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