scholarly journals Symmetry-induced even/odd parity in charge and heat pumping

2021 ◽  
Vol 103 (17) ◽  
Author(s):  
Miguel A. N. Araújo ◽  
Pedro Ninhos ◽  
Pedro Ribeiro
Keyword(s):  
Heat Pumping

Reduction of Surface Heat Pumping Effect in Split-Stirling Cryocoolers

Cryocoolers 9 ◽  
1997 ◽  
pp. 139-146 ◽  
Author(s):  
A. A. J. Benschop ◽  
F. C. v. Wordragen ◽  
P. C. Bruins
Keyword(s):  
Surface Heat ◽  
Pumping Effect ◽  
Heat Pumping

The employment of caloric-effect materials for solid-state heat pumping

2020 ◽  
Vol 109 ◽  
pp. 1-11 ◽  
Author(s):  
C. Aprea ◽  
A. Greco ◽  
A. Maiorino ◽  
C. Masselli
Keyword(s):  
Solid State ◽  
State Heat ◽  
Caloric Effect ◽  
Heat Pumping

scholarly journals Heat pumping with optically driven excitons

2010 ◽  
Vol 82 (7) ◽  
Author(s):  
Erik M. Gauger ◽  
Joachim Wabnig
Keyword(s):  
Heat Pumping

The fluorinated olefin R-1234ze(Z) as a high-temperature heat pumping refrigerant

2009 ◽  
Vol 32 (6) ◽  
pp. 1412-1422 ◽  
Author(s):  
J. Steven Brown ◽  
Claudio Zilio ◽  
Alberto Cavallini
Keyword(s):  
High Temperature ◽  
Temperature Heat ◽  
Heat Pumping

Energy-efficient miniature-scale heat pumping based on shape memory alloys

2016 ◽  
Vol 25 (8) ◽  
pp. 085037 ◽  
Author(s):  
Hinnerk Ossmer ◽  
Frank Wendler ◽  
Marcel Gueltig ◽  
Franziska Lambrecht ◽  
Shuichi Miyazaki ◽  
...  
Keyword(s):  
Shape Memory Alloys ◽  
Shape Memory ◽  
Energy Efficient ◽  
Heat Pumping

scholarly journals Annual energy performance of R744 and R410A heat pumping systems

2017 ◽  
Vol 117 ◽  
pp. 568-576 ◽  
Author(s):  
Zhequan Jin ◽  
Trygve M. Eikevik ◽  
Petter Nekså ◽  
Armin Hafner ◽  
Ruzhu Wang
Keyword(s):  
Energy Performance ◽  
Heat Pumping

Microscale Thermoelectric Cooler Assembled From Bulk Materials for Thermal Management of Electronics

2008 ◽  
Author(s):  
Pradeep Mishra ◽  
Nathan Crane
Keyword(s):  
Thermal Management ◽  
Electronic Device ◽  
Bulk Material ◽  
Electrical Contact ◽  
Coefficient Of Performance ◽  
Electrical Contact Resistance ◽  
Minimum Thickness ◽  
Maximum Heat ◽  
Thermoelectric Coolers ◽  
Heat Pumping

Electronic device thermal management improvements are critical to continued increases in computing performance. Thermoelectric coolers (TECs) show promise in meeting this need. This paper compares the performance of Bismuth Telluride (BiTe) in three different forms: thin film, bulk, and a hypothetical nanostructured bulk material. This hypothetical materials is based on recent experimental demonstrations in Lead Telluride. Performances of the TEC based on the three different BiTe forms are compared with respect to heat pumping capacity and optimum thickness. The simulations are based on 1-D models that include the effects of thermal and electrical contact resistance. Simulated results show a significant enhancement in maximum heat pumping capacity of ‘Nanostrutured-Bulk TEC’. Modified definitions of heat pumping capacity and coefficient of performance (COP) are proposed for evaluating TECs used to cool objects with temperatures above ambient temperature. It is observed that the appropriate heat sink selection is key factor for achieving the improved TEC performance while maintaining minimum thickness.

Thermoelectric heat pumping

1958 ◽  
Vol 77 (9) ◽  
pp. 802-806 ◽  
Author(s):  
N. E. Lindenblad
Keyword(s):  
Thermoelectric Heat ◽  
Heat Pumping
Sign in / Sign up

Export Citation Format

Share Document