scholarly journals Tuning the Mode Splitting of a Semiconductor Microcavity with Uniaxial Stress

2021 ◽  
Vol 15 (5) ◽  
Author(s):  
Natasha Tomm ◽  
Alexander R. Korsch ◽  
Alisa Javadi ◽  
Daniel Najer ◽  
Rüdiger Schott ◽  
...  
Keyword(s):  
Uniaxial Stress ◽  
Mode Splitting ◽  
Semiconductor Microcavity

Nonguiding semiconductor microcavity: Exciton-photon mode splitting and photoluminescence dynamics

1996 ◽  
Vol 40 (1-8) ◽  
pp. 487-491 ◽  
Author(s):  
J Bloch ◽  
V Thierry-Mieg ◽  
R Planel ◽  
B Sermage ◽  
S Long ◽  
...  
Keyword(s):  
Photon Mode ◽  
Mode Splitting ◽  
Semiconductor Microcavity

Delamination in the scoring and folding of paperboard

TAPPI Journal ◽  
2012 ◽  
Vol 11 (1) ◽  
pp. 61-66 ◽  
Author(s):  
DOEUNG D. CHOI ◽  
SERGIY A. LAVRYKOV ◽  
BANDARU V. RAMARAO
Keyword(s):  
Finite Element ◽  
Plane Deformation ◽  
Strain Analysis ◽  
Local Strain ◽  
Uniaxial Stress ◽  
Material Model ◽  
Element Model ◽  
Plastic Behavior ◽  
Stress Strain ◽  
Strain Fields

Delamination between layers occurs during the creasing and subsequent folding of paperboard. Delamination is necessary to provide some stiffness properties, but excessive or uncontrolled delamination can weaken the fold, and therefore needs to be controlled. An understanding of the mechanics of delamination is predicated upon the availability of reliable and properly calibrated simulation tools to predict experimental observations. This paper describes a finite element simulation of paper mechanics applied to the scoring and folding of multi-ply carton board. Our goal was to provide an understanding of the mechanics of these operations and the proper models of elastic and plastic behavior of the material that enable us to simulate the deformation and delamination behavior. Our material model accounted for plasticity and sheet anisotropy in the in-plane and z-direction (ZD) dimensions. We used different ZD stress-strain curves during loading and unloading. Material parameters for in-plane deformation were obtained by fitting uniaxial stress-strain data to Ramberg-Osgood plasticity models and the ZD deformation was modeled using a modified power law. Two-dimensional strain fields resulting from loading board typical of a scoring operation were calculated. The strain field was symmetric in the initial stages, but increasing deformation led to asymmetry and heterogeneity. These regions were precursors to delamination and failure. Delamination of the layers occurred in regions of significant shear strain and resulted primarily from the development of large plastic strains. The model predictions were confirmed by experimental observation of the local strain fields using visual microscopy and linear image strain analysis. The finite element model predicted sheet delamination matching the patterns and effects that were observed in experiments.

Sign in / Sign up

Export Citation Format

Share Document