Grain boundary atomic structures and light-element visualization in ceramics: combination of Cs-corrected scanning transmission electron microscopy and first-principles calculations

Microscopy ◽  
2011 ◽  
Vol 60 (suppl 1) ◽  
pp. S173-S188 ◽  
Author(s):  
Y. Ikuhara
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
First Principles ◽  
Scanning Transmission Electron Microscopy ◽  
Light Element ◽  
First Principles Calculations ◽  
Atomic Structures ◽  
Transmission Electron ◽  
Scanning Transmission

Layered stacking characteristics of ternary zirconium aluminum carbides

2007 ◽  
Vol 22 (11) ◽  
pp. 3058-3066 ◽  
Author(s):  
Z.J. Lin ◽  
L.F. He ◽  
M.S. Li ◽  
J.Y. Wang ◽  
Y.C. Zhou
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
First Principles ◽  
Scanning Transmission Electron Microscopy ◽  
Structural Information ◽  
Atomic Resolution ◽  
Layered Crystal ◽  
First Principles Calculations ◽  
Transmission Electron ◽  
Scanning Transmission

Layered stacking characteristics of ternary Zr–Al–C carbides were investigated using scanning transmission electron microscopy (STEM). Three previously unknown compounds, i.e., Zr4Al3C6, Zr5Al6C9, and Zr7Al6C11 were identified. The present study extends the structural information of ternary Zr–Al–C ceramics. The influence of the thickness of the NaCl-type Zr-C slab on the elastic properties of ternary Zr–Al–C ceramics is discussed based on first-principles calculations. In addition, direct atomic-resolution observations illustrate the process for forming the unique layered crystal structures of ternary Zr–Al–C ceramics. These results also provide insights into the formation mechanism of layered ternary Zr–Al–C carbides.

Investigation of Grain Boundary Structure and Composition of Bismuth Embrittled Copper Bicrystals with Aberration-Corrected Scanning Transmission Electron Microscopy

2012 ◽  
Vol 18 (S2) ◽  
pp. 346-347
Author(s):  
C. Wade ◽  
M. McLean ◽  
R. Vinci ◽  
M. Watanabe ◽  
L. Giannuzzi
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
Scanning Transmission Electron Microscopy ◽  
Boundary Structure ◽  
Scanning Transmission Electron ◽  
Grain Boundary Structure ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Aberration Corrected

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

scholarly journals Combining Scanning Transmission Electron Microscopy and Electron Diffraction to Understand the Atomic Structures of Oxide Superlattices

2011 ◽  
Vol 17 (S2) ◽  
pp. 1078-1079
Author(s):  
A Shah ◽  
B Nelson-Cheeseman ◽  
A Bhattacharya ◽  
J-M Zuo ◽  
J Spence
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Electron Diffraction ◽  
Scanning Transmission Electron Microscopy ◽  
Atomic Structures ◽  
Scanning Transmission Electron ◽  
Transmission Electron ◽  
Scanning Transmission

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

Grain Boundary Segregation of Bismuth in Copper

1981 ◽  
Vol 39 ◽  
pp. 286-287
Author(s):  
J. R. Michael ◽  
D. B. Williams
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Boundary ◽  
Electron Spectroscopy ◽  
Scanning Transmission Electron Microscopy ◽  
Auger Electron ◽  
Boundary Segregation ◽  
Grain Boundary Segregation ◽  
Transmission Electron ◽  
Scanning Transmission

Bismuth is known to segregate to grain boundaries in copper resulting in embrittlement and intergranular failure at low stress levels. This segregation has been studied primarily by Auger Electron Spectroscopy (AES). The applicability of scanning transmission electron microscopy (STEM)and Energy Dispersive Spectroscopy (EDS) to the study of equilibrium grain boundary segregation has already been demonstrated and the aim of this study is to determine the degree of segregation as a function of time and temperature. The major advantage of STEM over AES is that STEM does not require fracturing of the specimen, so the boundaries to be studied are left undisturbed. Thus, this technique is also applicable to systems which do not exhibit intergranular fracture.Cu-Bi specimens were prepared by evaporating Bi onto both sides of 3mm Cu discs, which were then heated for 1 week at 400°C to allow the Bi to diffuse into the Cu. The samples were then aged at 450, 550, 600, 650, and 700°C for 3 days and 12 days, ion-thinned and then examined in a Philips EM 400T TEM/STEM with an EDAX detector and EDAX 9100 analyzer. If necessary, the specimens were tilted such that the boundaries were parallel to the electron beam.

Structure stabilization effect of configuration entropy in cubic WN

2018 ◽  
Vol 20 (46) ◽  
pp. 29243-29248
Author(s):  
Wandong Xing ◽  
Yang Zhang ◽  
Fanyan Meng ◽  
Changchun Wang ◽  
Qiang Tao ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
First Principles ◽  
Scanning Transmission Electron Microscopy ◽  
Microscopic Structure ◽  
First Principles Calculations ◽  
Configuration Entropy ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Stabilization Effect ◽  
Structure Stabilization

The microscopic structure of cubic WN has been studied combining scanning transmission electron microscopy and first-principles calculations.

scholarly journals Coupling Atom Probe Tomography with Aberration-Corrected Scanning Transmission Electron Microscopy and First-Principles Computations to Investigate Omega Precipitation in Titanium Alloys

2013 ◽  
Vol 19 (S2) ◽  
pp. 946-947
Author(s):  
S. Nag ◽  
A. Devaraj ◽  
N. Gupta ◽  
R. Williams ◽  
S. Srivilliputhur ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Titanium Alloys ◽  
First Principles ◽  
Atom Probe Tomography ◽  
Scanning Transmission Electron Microscopy ◽  
Atom Probe ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Aberration Corrected

Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.

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