Development of a Mach-Zehnder type electron interferometer on a 1.2-MV field-emission transmission electron microscope

Microscopy ◽  
2020 ◽  
Vol 69 (6) ◽  
pp. 411-416
Author(s):  
Tetsuya Akashi ◽  
Yoshio Takahashi ◽  
Ken Harada
Keyword(s):  
Electron Microscope ◽  
Single Crystal ◽  
Single Crystals ◽  
Field Emission ◽  
Transmission Electron Microscope ◽  
Beam Splitters ◽  
Interference Fringes ◽  
Transmission Electron ◽  
Performance Results

Abstract We have developed an amplitude-division type Mach-Zehnder electron interferometer (MZ-EI). The developed MZ-EI is composed of single crystals corresponding to amplitude-division beam splitters, lenses corresponding to mirrors and an objective aperture. The spacings and azimuth angles of interference fringes can be controlled by single crystal materials and their orientations and by diffraction spots selected by the objective aperture. We built the MZ-EI on a 1.2-MV field-emission transmission electron microscope and tested its performance. Results showed that interference fringes were created for various spacings and azimuth angles, which demonstrates the practicability of the MZ-EI as an amplitude-division type electron interferometer.

scholarly journals Microstructure Evolution and Texture Development in a Cu-8.5%AT. AL Material Subjected to Hydrostatic Extrusion

2016 ◽  
Vol 61 (2) ◽  
pp. 933-936 ◽  
Author(s):  
D. Jakubowska ◽  
J. Zdunek ◽  
M. Kulczyk ◽  
J. Mizera ◽  
K. J. Kurzydłowski
Keyword(s):  
Electron Microscope ◽  
Single Crystal ◽  
Single Crystals ◽  
Transmission Electron Microscope ◽  
Texture Evolution ◽  
True Strain ◽  
Nanocrystalline Structure ◽  
Transmission Electron ◽  
The Stability ◽  
Xrd Method

AbstractThe aim of the present paper was to investigate microstructure and texture evolution of two single crystals and polycrystal of Cu-8.5%at.Al material. All of mentioned samples were deformed by HE to achieve true strain ε = 1.17. For microstructure analyzes observations by transmission electron microscope (STEM) were done. Crystalline size for samples after SPD were determine using XRD method. The global texture measurements were done using Bruker D8 Discover diffractometer equipped in Cr radiation. Microstructure investigations revealed nanocrystalline structure in single crystals with initial orientations <110> and <100> and polycrystalline Cu-8.5%at.Al material after SPD. The global texture measurements have shown the stability of initial orientation of <100> Cu-8.5%at.Al single crystal after HE, whereas the same SPD process strongly brakes up the orientation <110> Cu-8.5%at. Al single crystal.

Reconstruction of electron holograms recorded in a non-FEG, non-biprism TEM

1995 ◽  
Vol 53 ◽  
pp. 618-619
Author(s):  
Z.L. Wang
Keyword(s):  
Electron Microscope ◽  
Single Crystal ◽  
Experimental Technique ◽  
Transmission Electron Microscope ◽  
The Other ◽  
Electron Holography ◽  
Transmission Electron ◽  
Coherent Sources ◽  
Imaging Theory ◽  
Normal Specimen

An experimental technique for performing electron holography using a non-FEG, non-biprism transmission electron microscope (TEM) has been introduced by Ru et al. A double stacked specimens, one being a single crystal foil and the other the specimen, are loaded in the normal specimen position in TEM. The single crystal, which is placed onto the specimen, is responsible to produce two beams that are equivalent to two virtual coherent sources illuminating the specimen beneath, thus, permitting electron holography of the specimen. In this paper, the imaging theory of this technique is described. Procedures are introduced for digitally reconstructing the holograms.

Observation of dislocations in dynamically loaded Cu-SiO2

1986 ◽  
Vol 44 ◽  
pp. 424-425
Author(s):  
D. S. Pritchard
Keyword(s):  
Electron Microscope ◽  
Strain Rate ◽  
Single Crystal ◽  
Transmission Electron Microscope ◽  
Volume Fraction ◽  
Screw Dislocations ◽  
Spherical Inclusions ◽  
Transmission Electron ◽  
Crystal Dispersion ◽  
Strain Rate Loading

The effect of varying the strain rate loading conditions in compression on a copper single crystal dispersion-hardened with SiO2 particles has been examined. These particles appear as small spherical inclusions in the copper lattice and have a volume fraction of 0.6%. The structure of representative crystals was examined prior to any testing on a transmission electron microscope (TEM) to determine the nature of the dislocations initially present in the tested crystals. Only a few scattered edge and screw dislocations were viewed in those specimens.

Characterization of JEOL 3000f TEM Equipped for Electron Holography

2000 ◽  
Vol 6 (S2) ◽  
pp. 228-229
Author(s):  
M. A. Schofield ◽  
Y. Zhu
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Design Of Experiment ◽  
Electron Holography ◽  
Fringe Spacing ◽  
Interference Fringes ◽  
Transmission Electron ◽  
Careful Design

Quantitative off-axis electron holography in a transmission electron microscope (TEM) requires careful design of experiment specific to instrumental characteristics. For example, the spatial resolution desired for a particular holography experiment imposes requirements on the spacing of the interference fringes to be recorded. This fringe spacing depends upon the geometric configuration of the TEM/electron biprism system, which is experimentally fixed, but also upon the voltage applied to the biprism wire of the holography unit, which is experimentally adjustable. Hence, knowledge of the holographic interference fringe spacing as a function of applied voltage to the electron biprism is essential to the design of a specific holography experiment. Furthermore, additional instrumental parameters, such as the coherence and virtual size of the electron source, for example, affect the quality of recorded holograms through their effect on the contrast of the holographic fringes.

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

2009 ◽  
Vol 24 (8) ◽  
pp. 2638-2643 ◽  
Author(s):  
Kai-Jheng Wang ◽  
Yan-Zuo Tsai ◽  
Jenq-Gong Duh ◽  
Toung-Yi Shih
Keyword(s):  
Electron Microscope ◽  
Field Emission ◽  
Formation Mechanism ◽  
Transmission Electron Microscope ◽  
Electron Probe ◽  
Under Bump Metallization ◽  
Rich Phase ◽  
Snagcu Solder ◽  
Electron Probe Microanalyzer ◽  
Transmission Electron

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn–Ag–Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed.

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