The Kinetics Study of Dissolving SnPb Solder by Hydrometallurgy

2019 ◽  
Vol 36 (9) ◽  
pp. 1236-1243
Author(s):  
Ping Zhu ◽  
Jiakang Tang ◽  
Qi Tao ◽  
Yangjun Wang ◽  
Jingpei Wang ◽  
...  
Keyword(s):  
Kinetics Study ◽  
Snpb Solder

Pulse radiolysis of polymers in aqueous solution. Kinetics study

1997 ◽  
Vol 94 ◽  
pp. 244-250 ◽  
Author(s):  
I Janik ◽  
P Kujawa ◽  
P Ulanski ◽  
JM Rosiak
Keyword(s):  
Aqueous Solution ◽  
Pulse Radiolysis ◽  
Kinetics Study ◽  
Solution Kinetics

Anaerobic Digestion of Slaughterhouse Wastewater: A Kinetics Study

2014 ◽  
Vol 2014 (2) ◽  
pp. 71-80
Author(s):  
Chinenyenwa Nweke ◽  
◽  
Philomena Igbokwe ◽  
Joseph Nwabanne ◽  
◽  
...  
Keyword(s):  
Anaerobic Digestion ◽  
Kinetics Study ◽  
Slaughterhouse Wastewater

SYNTHESIS AND REACTION KINETICS STUDY OF TRI PHENYL PHOSPHITE

2019 ◽  
Vol 2 (2) ◽  
pp. 99-106
Author(s):  
Satish M. Mane ◽  
M. Praharaj Bhatnagar ◽  
M. R. Sawant ◽  
B. N. Thorat
Keyword(s):  
Reaction Kinetics ◽  
Kinetics Study

1151-P: Dorzagliatin Differentiates from Early Generation of Glucokinase Activators: An Enzyme Kinetics Study

Diabetes ◽  
2019 ◽  
Vol 68 (Supplement 1) ◽  
pp. 1151-P
Author(s):  
LI CHEN ◽  
YONGQIANG SHAN ◽  
XIAOWEI JIN ◽  
XIAOBING LV
Keyword(s):  
Enzyme Kinetics ◽  
Kinetics Study ◽  
Early Generation ◽  
Glucokinase Activators

EQUILIBRIUM AND KINETICS STUDY OF NITRATE REMOVAL FROM WATER BY PUROLITE A520-E RESIN

2012 ◽  
Vol 11 (1) ◽  
pp. 37-45 ◽  
Author(s):  
Liliana Lazar ◽  
Laura Bulgariu ◽  
Anca Ceica ◽  
Igor Cretescu ◽  
Ion Balasanian
Keyword(s):  
Nitrate Removal ◽  
Kinetics Study ◽  
Equilibrium And Kinetics

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

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