scholarly journals Projection-suspended stereolithography 3D printing for low-loss optical hydrogel fiber fabrication

APL Photonics ◽  
2021 ◽  
Author(s):  
Xuan Zhuo ◽  
Hua Shen ◽  
Yinxu Bian ◽  
Anni Xu ◽  
Rihong Zhu
2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


2020 ◽  
Vol 104 (2) ◽  
pp. 833-850 ◽  
Author(s):  
Pengfei Wang ◽  
Alson Kwun Leung Ng ◽  
Alastair Dowler ◽  
Heike Ebendorff‐Heidepriem

2017 ◽  
Vol 2017 (1) ◽  
pp. 000252-000257 ◽  
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


2020 ◽  
Author(s):  
Guofu Xu ◽  
Kathirvel Nallappan ◽  
Yang Cao ◽  
Maksim Skorobogatiy

In this work we explore infinity 3D printing technique to fabricate continuous several-meter-long low-loss near-zero dispersion suspended-core polypropylene fibers for application in terahertz communications. The novel filament deposition modeling (FDM)- based infinity printing technique allows continuous fabrication of unlimited in length fiber sections of complex transverse geometries using advanced thermoplastic composites, and in our opinion is poised to become a key technique for advanced terahertz fiber manufacturing. Furthermore, particular attention in our work is payed to process parameter optimization for printing with low-loss polypropylene plastic, as well as an in-depth comparison between fibers printed using standard FDM 3D printers and infinity 3D printers.


2016 ◽  
Vol 22 (2) ◽  
pp. 251-257 ◽  
Author(s):  
Xiaoyong Tian ◽  
Ming Yin ◽  
Dichen Li

Purpose Artificial electromagnetic (EM) medium and devices are designed with integrated micro- and macro-structures depending on the EM transmittance performance, which is difficult to fabricate by the conventional processes. Three-dimensional (3D) printing provides a new solution for the delicate artificial EM medium. This paper aims to first review the applications of 3D printing in the fabrication of EM medium briefly, mainly focusing on photonic crystals, metamaterials and gradient index (GRIN) devices. Then, a new design and fabrication strategy is proposed for the EM medium based on the 3D printing process, which was verified by the implementation of a 3D 90o Eaton lens based on GRIN metamaterials. Design/methodology/approach A new design and manufacturing strategy driven by the physical (EM transmittance) performance is proposed to illustrate the realization procedures of EM medium based device with controllable micro- and macro-structures. Stereolithography-based 3D printing process is used to obtain the designed EM device, an GRIN Eaton lens. The EM transmittance of the Eaton lens was validated experimentally and by simulation. Findings A 3D 90o Eaton lens was realized based on GRIN metamaterials structure according to the proposed design and manufacturing strategy, which had the broadband (12-18 GHz) and low loss characteristic. The feasibility of 3D printing for the artificial EM medium and GRIN devices has been verified for the further real applications in the industries. Originality/value The applications of 3D printing in artificial EM medium and devices were systematically reviewed. A new design strategy driven by physical performance for the EM device was proposed and validated by the firstly 3D printed 3D Eaton lens.


Author(s):  
David C. Joy ◽  
Dennis M. Maher

High-resolution images of the surface topography of solid specimens can be obtained using the low-loss technique of Wells. If the specimen is placed inside a lens of the condenser/objective type, then it has been shown that the lens itself can be used to collect and filter the low-loss electrons. Since the probeforming lenses in TEM instruments fitted with scanning attachments are of this type, low-loss imaging should be possible.High-resolution, low-loss images have been obtained in a JEOL JEM 100B fitted with a scanning attachment and a thermal, fieldemission gun. No modifications were made to the instrument, but a wedge-shaped, specimen holder was made to fit the side-entry, goniometer stage. Thus the specimen is oriented initially at a glancing angle of about 30° to the beam direction. The instrument is set up in the conventional manner for STEM operation with all the lenses, including the projector, excited.


Author(s):  
Oliver C. Wells

The low-loss electron (LLE) image in the scanning electron microscope (SEM) is useful for the study of uncoated photoresist and some other poorly conducting specimens because it is less sensitive to specimen charging than is the secondary electron (SE) image. A second advantage can arise from a significant reduction in the width of the “penetration fringe” close to a sharp edge. Although both of these problems can also be solved by operating with a beam energy of about 1 keV, the LLE image has the advantage that it permits the use of a higher beam energy and therefore (for a given SEM) a smaller beam diameter. It is an additional attraction of the LLE image that it can be obtained simultaneously with the SE image, and this gives additional information in many cases. This paper shows the reduction in penetration effects given by the use of the LLE image.


Author(s):  
C P Scott ◽  
A J Craven ◽  
C J Gilmore ◽  
A W Bowen

The normal method of background subtraction in quantitative EELS analysis involves fitting an expression of the form I=AE-r to an energy window preceding the edge of interest; E is energy loss, A and r are fitting parameters. The calculated fit is then extrapolated under the edge, allowing the required signal to be extracted. In the case where the characteristic energy loss is small (E < 100eV), the background does not approximate to this simple form. One cause of this is multiple scattering. Even if the effects of multiple scattering are removed by deconvolution, it is not clear that the background from the recovered single scattering distribution follows this simple form, and, in any case, deconvolution can introduce artefacts.The above difficulties are particularly severe in the case of Al-Li alloys, where the Li K edge at ~52eV overlaps the Al L2,3 edge at ~72eV, and sharp plasmon peaks occur at intervals of ~15eV in the low loss region. An alternative background fitting technique, based on the work of Zanchi et al, has been tested on spectra taken from pure Al films, with a view to extending the analysis to Al-Li alloys.


Author(s):  
Daniel UGARTE

Small particles exhibit chemical and physical behaviors substantially different from bulk materials. This is due to the fact that boundary conditions can induce specific constraints on the observed properties. As an example, energy loss experiments carried out in an analytical electron microscope, constitute a powerful technique to investigate the excitation of collective surface modes (plasmons), which are modified in a limited size medium. In this work a STEM VG HB501 has been used to study the low energy loss spectrum (1-40 eV) of silicon spherical particles [1], and the spatial localization of the different modes has been analyzed through digitally acquired energy filtered images. This material and its oxides have been extensively studied and are very well characterized, because of their applications in microelectronics. These particles are thus ideal objects to test the validity of theories developed up to now.Typical EELS spectra in the low loss region are shown in fig. 2 and energy filtered images for the main spectral features in fig. 3.


Sign in / Sign up

Export Citation Format

Share Document