Characterization of voids in thermal joint of semiconductor package using scanning acoustic microscope
1993 ◽
Vol 59
(568)
◽
pp. 2970-2976
1999 ◽
Vol 29
(2)
◽
pp. 287-291
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Keyword(s):
2003 ◽
Vol 113
(4)
◽
pp. 2324-2324