Experimental investigation on copper metal powder for substrate steel

2020 ◽  
Author(s):  
Sriram Venkateswaran ◽  
J. Antony Jackwin ◽  
Badrinath ◽  
Kanimozhi Balakrishnan
Author(s):  
Donald E. Floyd ◽  
Mark J. Topolski ◽  
Jeff Darabi

This paper present an analytical and experimental investigation of the performance of metal foams in an impinging flow application. Microstructures of the foam as well as the foam-to-solid braze interface are presented. Aditionally, the effects of brazing procedure on the performance of the heat exchanger are investigated and the results are compared to CFD analysis assuming perfect braze joints. Finally, the results are compared to commercially available micro-channel heat exchangers.


1963 ◽  
Vol 1 (2) ◽  
pp. 114-120
Author(s):  
R. A. Andrievskii ◽  
M. A. Dmitrieva

Metals ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 721 ◽  
Author(s):  
Kyoungkeun Yoo ◽  
Yujin Park ◽  
Sanghyeon Choi ◽  
Ilhwan Park

A new concept for copper (Cu) metal leaching by the simultaneous use of cupric ions (Cu2+) and oxygen (O2) was proposed to improve Cu metal leaching in sulfuric acid. According to this concept, Cu2+ oxidizes Cu metal into cuprous ion (Cu+), and O2 oxidizes Cu+ into Cu2+. The improvement in Cu leaching efficiency from Cu metal was investigated experimentally in the sulfuric acid solution using Cu2+ and O2 simultaneously. Furthermore, the result was compared with that for the sulfuric acid solution containing neither Cu2+ nor O2 and with the sulfuric acid solution without Cu2+ and O2. When both Cu2+ and O2 were used in the leaching solution, the leaching rate of Cu from Cu metal powder was higher than at other leaching conditions, and the leaching efficiency of Cu increased to more than 99.9% in 1 mol/L sulfuric acid solution at 400 rpm and 50 °C with ≤75 µm Cu metal powder, 1% pulp density, 10,000 mg/L initial Cu2+ concentration, and 100 cc/min O2 introduction. These results indicated that the leaching of Cu from Cu metal could be accelerated by adding Cu2+ and O2 in the sulfuric acid solution.


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