High thermal conductivity of free-standing skeleton in graphene foam

2020 ◽  
Vol 117 (25) ◽  
pp. 251901
Author(s):  
Jianshu Gao ◽  
Danmei Xie ◽  
Xinwei Wang ◽  
Xin Zhang ◽  
Yanan Yue
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Free Standing ◽  
Graphene Foam

Measurement of Thermal Diffusivity of Cvd diamond films using modified ac calorimetry

1995 ◽  
Vol 416 ◽  
Author(s):  
Akikazu Maesono ◽  
Ronald. P. Tye
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Cvd Diamond ◽  
High Thermal Conductivity ◽  
Ac Calorimetry ◽  
Free Standing ◽  
International Round ◽  
Flow Directions ◽  
Very High

ABSTRACTMany applications of thin films, especially for electronics devices, require that these materials, which are often anisotropic, have a very high thermal conductivity as well as uniform areal properties to ensure that reproducible performance be attained. These factors necessitate that measurements of thermal transport properties are required both to provide absolute application values for different heat flow directions as well as to evaluate uniformity and homogeneity of a wafer. For diamond, the combination of a very high thermal conductivity with limited size and form of available specimen presents unique challenges to the experimentalist. As a result, a modification of the ac calorimeter method has been developed to evaluate the thermal diffusivity of thin films.Details of the technique will be provided together with examples of its use to evaluate thermal diffusivity and thermal conductivity of different CVD diamond film composites having thicknesses from 10µm to 600µm and free-standing films. In addition, results using this method will be compared. with those obtained by other techniques involved in a recent international round-robin measurements program designed to evaluate a potential standard method(s).

Preparation of 1D C/C Composites with High Thermal Conductivity

2013 ◽  
Vol 28 (12) ◽  
pp. 1338-1344 ◽  
Author(s):  
Jian-Feng LIN ◽  
Guan-Ming YUAN ◽  
Xuan-Ke LI ◽  
Zhi-Jun DONG ◽  
Jiang ZHANG ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity

High thermal conductivity carbon fiber reinforced polymer based on a carbon fiber from pitch and dispersed-filled ENPB matrix

2018 ◽  
pp. 130-137
Author(s):  
E. A. Nikolaeva ◽  
A. N. Timofeev ◽  
K. V. Mikhaylovskiy
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
High Thermal Conductivity ◽  
Fiber Reinforced Polymer ◽  
Carbon Fiber Reinforced Polymer ◽  
Carbon Powder ◽  
Fiber Reinforced ◽  
Thermophysical Characteristics ◽  
Reinforced Polymer ◽  
Carbon Fiber Reinforced

This article describes the results of the development of a high thermal conductivity carbon fiber reinforced polymer based on carbon fiber from pitch and an ENPB matrix modified with a carbon powder of high thermal conductivity. Data of the technological scheme of production and the results of determining the physicomechanical and thermophysical characteristics of carbon fiber reinforced polymer are presented. 

Strain tuned high thermal conductivity in boron phosphide at nanometer length scales – a first-principles study

2020 ◽  
Vol 22 (36) ◽  
pp. 20914-20921 ◽  
Author(s):  
Rajmohan Muthaiah ◽  
Jivtesh Garg
Keyword(s):  
Thermal Conductivity ◽  
First Principles ◽  
High Thermal Conductivity ◽  
Biaxial Strain ◽  
Length Scales ◽  
First Principles Study ◽  
Boron Phosphide

We report novel pathways to significantly enhance the thermal conductivity at nanometer length scales in boron phosphide through biaxial strain.

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