scholarly journals Low-temperature statistical mechanics of the Quantizer problem: Fast quenching and equilibrium cooling of the three-dimensional Voronoi liquid

2020 ◽  
Vol 153 (23) ◽  
pp. 234505
Author(s):  
Tobias M. Hain ◽  
Michael A. Klatt ◽  
Gerd E. Schröder-Turk
Keyword(s):  
Low Temperature ◽  
Statistical Mechanics ◽  
Three Dimensional ◽  
Fast Quenching

scholarly journals Rapid Growth of TiO2 Nanoflowers via Low-Temperature Solution Process: Photovoltaic and Sensing Applications

Materials ◽  
2019 ◽  
Vol 12 (4) ◽  
pp. 566 ◽  
Author(s):  
M. Akhtar ◽  
Ahmad Umar ◽  
Swati Sood ◽  
InSung Jung ◽  
H. Hegazy ◽  
...  
Keyword(s):  
Low Temperature ◽  
Anatase Phase ◽  
Three Dimensional ◽  
Solution Process ◽  
Dye Sensitized Solar Cell ◽  
Sensor Applications ◽  
Dye Sensitized ◽  
Sensing Applications ◽  
Density Growth ◽  
Temperature Solution

This paper reports the rapid synthesis, characterization, and photovoltaic and sensing applications of TiO2 nanoflowers prepared by a facile low-temperature solution process. The morphological characterizations clearly reveal the high-density growth of a three-dimensional flower-shaped structure composed of small petal-like rods. The detailed properties confirmed that the synthesized nanoflowers exhibited high crystallinity with anatase phase and possessed an energy bandgap of 3.2 eV. The synthesized TiO2 nanoflowers were utilized as photo-anode and electron-mediating materials to fabricate dye-sensitized solar cell (DSSC) and liquid nitroaniline sensor applications. The fabricated DSSC demonstrated a moderate conversion efficiency of ~3.64% with a maximum incident photon to current efficiency (IPCE) of ~41% at 540 nm. The fabricated liquid nitroaniline sensor demonstrated a good sensitivity of ~268.9 μA mM−1 cm−2 with a low detection limit of 1.05 mM in a short response time of 10 s.

Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications

2005 ◽  
Vol 89 (1) ◽  
pp. 72-79 ◽  
Author(s):  
P.K. Khanna ◽  
B. Hornbostel ◽  
M. Burgard ◽  
W. Schäfer ◽  
J. Dorner
Keyword(s):  
Low Temperature ◽  
Three Dimensional ◽  
Cofired Ceramics

LOW TEMPERATURE MODELS OF METAL OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTORS

1995 ◽  
Vol 06 (02) ◽  
pp. 317-373 ◽  
Author(s):  
G. GILDENBLAT ◽  
D. FOTY
Keyword(s):  
Low Temperature ◽  
Field Effect Transistors ◽  
Numerical Models ◽  
Three Dimensional ◽  
Oxide Semiconductor ◽  
Characteristic Time Scale ◽  
Mos Transistors ◽  
Short Channel ◽  
Temperature Range ◽  
Dimensional Models

We review the modeling of silicon MOS devices in the 10–300 K temperature range with an emphasis on the specifics of low-temperature operation. Recently developed one-dimensional models of long-channel transistors are discussed in connection with experimental determination and verification of the effective channel mobility in a wide temperature range. We also present analytical pseudo-two-dimensional models of short-channel devices which have been proposed for potential use in circuit simulators. Several one-, two-, and three-dimensional numerical models are discussed in order to gain insight into the more subtle details of the low-temperature device physics of MOS transistors and capacitors. Particular attention is paid to freezeout effects which, depending on the device design and the ambient temperature range, may or may not be important for actual device operation. The numerical models are applied to study the characteristic time scale of freezeout transients in the space-charge regions of silicon devices, to the analysis and suppression of delayed turn-off in MOS transistors with compensated channel, and to the temperature dependence of three-dimensional effects in short-channel, narrow-channel MOSFETs.

scholarly journals The Effect of Agarose on 3D Bioprinting

Polymers ◽  
2021 ◽  
Vol 13 (22) ◽  
pp. 4028
Author(s):  
Chi Gong ◽  
Zhiyuan Kong ◽  
Xiaohong Wang
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Internal Structure ◽  
Three Dimensional ◽  
3D Bioprinting ◽  
Two Temperatures ◽  
Formed Structure ◽  
Accuracy And Stability ◽  
Physical Crosslinking ◽  
Complex Organ

In three-dimensional (3D) bioprinting, the accuracy, stability, and mechanical properties of the formed structure are very important to the overall composition and internal structure of the complex organ. In traditional 3D bioprinting, low-temperature gelatinization of gelatin is often used to construct complex tissues and organs. However, the hydrosol relies too much on the concentration of gelatin and has limited formation accuracy and stability. In this study, we take advantage of the physical crosslinking of agarose at 35–40 °C to replace the single pregelatinization effect of gelatin in 3D bioprinting, and printing composite gelatin/alginate/agarose hydrogels at two temperatures, i.e., 10 °C and 24 °C, respectively. After in-depth research, we find that the structures manufactured by the pregelatinization method of agarose are significantly more accurate, more stable, and harder than those pregelatined by gelatin. We believe that this research holds the potential to be widely used in the future organ manufacturing fields with high structural accuracy and stability.

Experimental Study on Mechanical Properties of Rubber Used for Damping Bearing

2011 ◽  
Vol 189-193 ◽  
pp. 1132-1136 ◽  
Author(s):  
Yong Xu Zhao ◽  
Wen Jun Hu ◽  
Jun Mei ◽  
Niu Wei ◽  
Jian Jun Xie
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Three Dimensional ◽  
Middle Part ◽  
Loading Conditions ◽  
Deflection Curve ◽  
Rubber Bearing ◽  
Components Analysis ◽  
The Impact ◽  
Load Deflection Curve

After testing on T-type rubber bearing under tensile, compression and shear mechanical properties under different temperature in this paper. Obtained load deflection curve and destructive mode under different loading conditions at -40 and normal temperature of rubber components. Analysis the impact of temperature and the loading conditions that effect on load-elongation and destructive mode of T-type damping rubber structure. It showed that T-end rubber bearing has different kinds of deformation under different force-giving methods. Under compression, the stress pattern of the rubber bearing is three-dimensional and middle rubber bear the greatest force. Under tensile loading, the middle part of the rubber contract and the side with smaller lateral section has greater shrinkage; moreover, damage occurred in the area with stress concentration and weak strength. Under shearing action, extrude faces appeared with crinkle and damage occurred in the middle part of extrude faces. At the low temperature-40 , rubber support still has great elastic properties. The low temperature has a big effect on tensile properties and has little effect on damage properties.

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