scholarly journals Thermal conductivity of irradiated porous silicon down to the oxide limit investigated by Raman thermometry and scanning thermal microscopy

2020 ◽  
Vol 128 (17) ◽  
pp. 175109 ◽  
Author(s):  
A. M. Massoud ◽  
P.-O. Chapuis ◽  
B. Canut ◽  
J.-M. Bluet
Keyword(s):  
Thermal Conductivity ◽  
Porous Silicon ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Surface Temperature ◽  
Cell Walls ◽  
Adhesive Contact ◽  
Wood Adhesive ◽  
Bond Line ◽  
Scanning Thermal Microscopy ◽  
Thermal Probe ◽  
Thermal Microscopy

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.

Thermal conductivity of SiO2 films by scanning thermal microscopy

1999 ◽  
Vol 245 (1-3) ◽  
pp. 203-209 ◽  
Author(s):  
S Callard ◽  
G Tallarida ◽  
A Borghesi ◽  
L Zanotti
Keyword(s):  
Thermal Conductivity ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Sio2 Films

Characterization of the thermal conductivity of insulating thin films by scanning thermal microscopy

2013 ◽  
Vol 44 (11) ◽  
pp. 1029-1034 ◽  
Author(s):  
Séverine Gomès ◽  
Pascal Newby ◽  
Bruno Canut ◽  
Konstantinos Termentzidis ◽  
Olivier Marty ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

Investigation of the Accuracy and Spatial Resolution of Scanning Thermal Microscopy (SThM) Technique

2005 ◽  
Author(s):  
Hsinyi Lo ◽  
Wenjun Liu ◽  
Mehdi Asheghi
Keyword(s):  
Thermal Conductivity ◽  
Spatial Resolution ◽  
Temperature Sensor ◽  
Temperature Gradients ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy ◽  
Temperature Distributions ◽  
Unique Definition ◽  
Thermocouple Junction ◽  
Heated Metal

Scanning Thermal Microscopy (SThM) employs a thermocouple as the scanning sensor to capture thermal images with sub-micron spatial resolution. After nearly two decades of research and development in this area, many outstanding issues/questions related to the accuracy and resolution of SThM technique has remained either unanswered or at best ambiguously defined. The present work uses numerical simulation for heat conduction in a combined SThM probe and device to obtain temperature distributions in various heated nanostructures. The limits of accuracy and spatial resolution of the SThM technique for heated metal bridges are estimated using a probe with 100 nm thermocouple junction as the temperature sensor. It is concluded mat large errors in temperature measurements should be expected for small devices that are fabricated on poor thermal conductivity substrates. There is no clear and unique definition for the spatial resolution of the SThM technique as it may change for different device configuration and substrates. It appears that the finite dimensions of the probe and contact area impose a limit on the spatial resolution of the SThM, which is strongly influenced by temperature gradients across the device under test.

scholarly journals Mapping thermal conductivity across bamboo cell walls with scanning thermal microscopy

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Darshil U. Shah ◽  
Johannes Konnerth ◽  
Michael H. Ramage ◽  
Claudia Gusenbauer
Keyword(s):  
Thermal Conductivity ◽  
Cell Walls ◽  
Vascular Tissue ◽  
Thin Layers ◽  
Cellulose Microfibrils ◽  
Natural Material ◽  
Scanning Thermal Microscopy ◽  
Cell Axis ◽  
Thermal Microscopy ◽  
Fibre Cell

Abstract Scanning thermal microscopy is a powerful tool for investigating biological materials and structures like bamboo and its cell walls. Alongside nanoscale topographical information, the technique reveals local variations in thermal conductivity of this elegant natural material. We observe that at the tissue scale, fibre cells in the scattered vascular tissue would offer preferential pathways for heat transport due to their higher conductivities in both anatomical directions, in comparison to parenchymatic cells in ground tissue. In addition, the transverse orientation offers more resistance to heat flow. Furthermore, we observe each fibre cell to compose of up to ten layers, with alternating thick and thin lamellae in the secondary wall. Notably, we find the thin lamellae to have relatively lower conductivity than the thick lamellae in the fibre direction. This is due to the distinct orientation of cellulose microfibrils within the cell wall layers, and that cellulose microfibrils are highly anisotropic and have higher conductivity along their lengths. Microfibrils in the thick lamellae are oriented almost parallel to the fibre cell axis, while microfibrils in the thin lamellae are oriented almost perpendicular to the cell axis. Bamboo grasses have evolved to rapidly deposit this combination of thick and thin layers, like a polymer composite laminate or cross-laminated timber, for combination of axial and transverse stiffness and strength. However, this architecture is found to have interesting implications on thermal transport in bamboo, which is relevant for the application of engineered bamboo in buildings. We further conclude that scanning thermal microscopy may be a useful technique in plant science research, including for phenotyping studies.

Measuring the thermal conductivity of residue-free suspended graphene bridge using null point scanning thermal microscopy

Carbon ◽  
2014 ◽  
Vol 76 ◽  
pp. 77-83 ◽  
Author(s):  
Kichul Yoon ◽  
Gwangseok Hwang ◽  
Jaehun Chung ◽  
Hong goo Kim ◽  
Ohmyoung Kwon ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Null Point ◽  
Scanning Thermal Microscopy ◽  
Suspended Graphene ◽  
Thermal Microscopy

scholarly journals Fabrication of Bi2Te3 nanowire arrays and thermal conductivity measurement by 3ω-scanning thermal microscopy

2013 ◽  
Vol 113 (5) ◽  
pp. 054308 ◽  
Author(s):  
M. Muñoz Rojo ◽  
S. Grauby ◽  
J.-M. Rampnoux ◽  
O. Caballero-Calero ◽  
M. Martin-Gonzalez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Conductivity Measurement ◽  
Nanowire Arrays ◽  
Thermal Conductivity Measurement ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy
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