scholarly journals Stress singularity analysis of anisotropic multi-material wedges under antiplane shear deformation using the symplectic approach

2011 ◽  
Vol 1 (6) ◽  
pp. 061003 ◽  
Author(s):  
Xiaofei Hu ◽  
Weian Yao ◽  
Zhaoxiang Fang
Keyword(s):  
Shear Deformation ◽  
Stress Singularity ◽  
Singularity Analysis ◽  
Antiplane Shear

The Reliability of Fragmentation Test

2006 ◽  
Vol 312 ◽  
pp. 155-160
Author(s):  
Ying Dai ◽  
Xing Ji ◽  
Lin Ye ◽  
Yiu Wing Mai
Keyword(s):  
Shear Strength ◽  
Failure Modes ◽  
Interfacial Shear Strength ◽  
Stress Singularity ◽  
Singularity Analysis ◽  
Interfacial Shear ◽  
Matrix Cracking ◽  
Fragmentation Test ◽  
Matrix Cracks ◽  
Fiber Breaks

The single fiber fragmentation test has been continuously used to determine the interfacial shear strength. However, the results of the tests were still suspected by some researchers. To evaluate the reliability of the fragmentation test, the stress singularity near the interface end of fragmentation is investigated. According to the local failure modes near the interface end of a fiber fragment, there are three cases of the interface end conditions to be considered for the fragmentation tests: (A) fiber breaks only, without matrix cracking and de-bonding, (B) fiber breaks and matrix cracks, without interface de-bonding, (C) fiber breaks and interface de-bonds, with or without matrix cracking. After the singularity analysis of stress field near the interface end was depicted, it is obvious, that the interfacial shear strength given by the fragmentation test is not proper, because of that a stress singularity exists near the interface end.

Groove Bottom Contours of Minimum Stress Concentration for Antiplane Shear Deformation

1985 ◽  
Vol 52 (2) ◽  
pp. 379-384 ◽  
Author(s):  
B. H. Eldiwany ◽  
L. T. Wheeler
Keyword(s):  
Stress Concentration ◽  
Numerical Methods ◽  
Shear Deformation ◽  
Half Space ◽  
Optimization Problems ◽  
Integral Form ◽  
Antiplane Shear ◽  
Space Boundary ◽  
Minimum Stress ◽  
Special Case

Results from free streamline hydrodynamics are exploited in order to solve optimization problems for antiplane shear deformation, in which the stress concentration is to be minimized. These problems pertain to the optimum shapes for grooves cut into a half-space. We obtain results, which from the standpoint of the hydrodynamics problem, complement those presently in the literature. The solution is given in an integral form which in general must be evaluated by numerical methods, but that reduces to elliptic integrals for the special case of a notch whose faces meet the half-space boundary at right angles.

Stress Singularity at the Tip of a Rigid Line Inhomogeneity Under Antiplane Shear Loading

1986 ◽  
Vol 53 (2) ◽  
pp. 459-461 ◽  
Author(s):  
Z. Y. Wang ◽  
H. T. Zhang ◽  
Y. T. Chou
Keyword(s):  
Stress Singularity ◽  
Shear Loading ◽  
Antiplane Shear ◽  
Rigid Line

Three-Dimensional Stress Singularity Analysis Around the Solder Joints in Electronic Packaging Using Eigen Analysis

2003 ◽  
Author(s):  
Monchai Prukvilailert ◽  
Hideo Koguchi
Keyword(s):  
Mechanical Properties ◽  
Electronic Packaging ◽  
Flip Chip ◽  
Solder Bump ◽  
Three Dimensional ◽  
Stress Singularity ◽  
Dissimilar Materials ◽  
Singularity Analysis ◽  
Contact Angles ◽  
Eigen Analysis

Electronic packaging has several kinds of joint structures of metal, ceramic and polymer. It is well known that the stress singularity occurs at the vertex of joint where the dissimilar materials are bonded together. In this paper, the model in the first analysis is an electronic package using surface mount technology (SMT), the order of stress singularity is investigated, when the mechanical properties of solder, adhesive and resin vary for several values of contact angles between the solder with the chip and with a Cu land. Furthermore, the model in the second analysis is a Flip-Chip-on-Board packaging (FCOB), in which the order of stress singularity at the solder bump is investigated varying the mechanical properties of solder, underfill and the contact angle between the solder bump with a Cu track. After that, the displacement and stress fields for several values of the order of stress singularity are calculated by solving an eigen equation.

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