Low temperature peak of internal friction in high entropy Al0.5CoCrCuFeNi alloy

2020 ◽  
Vol 46 (1) ◽  
pp. 78-86
Author(s):  
Yu. A. Semerenko ◽  
V. D. Natsik
2006 ◽  
Vol 319 ◽  
pp. 151-156 ◽  
Author(s):  
Y. Hiki ◽  
M. Tanahashi ◽  
Shin Takeuchi

In a hydrogen-doped metallic glass, there appear low-temperature and high-temperature internal friction peaks respectively associated with a point-defect relaxation and the crystallization. The high-temperature-side slope of low-temperature peak and also the low-temperature-side slope of high-temperature peak enhance the background internal friction near the room temperature. A hydrogen-doped Mg-base metallic glass was proposed as a high-damping material to be used near and somewhat above the room temperature. Stability of the high damping was also checked.


1999 ◽  
Vol 25 (7) ◽  
pp. 558-565 ◽  
Author(s):  
V. D. Natsik ◽  
P. P. Pal-Val ◽  
L. N. Pal-Val ◽  
Yu. A. Semerenko

1959 ◽  
Vol 114 (5) ◽  
pp. 1273-1273 ◽  
Author(s):  
Edward Lax ◽  
Daniel H. Filson

2012 ◽  
Vol 560-561 ◽  
pp. 1078-1083
Author(s):  
Jin Xiang Wang ◽  
Xiao Bo Peng

The porous Cu specimens were prepared using infiltration process. Its damping behavior was investigated using multifunction internal friction apparatus over the temperature range from 40°C to 500°C.The size of macroscopic pore is in the order of a millimeter (1.0mm) and in large proportions, typically up to 60vol%. The measured IF (internal friction) shows that the damping capacity of porous Cu is higher than that of its bulk metal. It’s found that two IF peaks present at the internal friction against temperature curves at around 280°C and 400°C.The high-temperature arises from the relaxation of grain boundaries. The low-temperature peak may origin from the interaction of dislocation and grain boundaries. TEM observations showed the dislocation substructures exist in the porous Cu. Based on the observed experimental phenomena, a four-parameter mechanical model was used for describing the operative damping mechanism of the low-temperature peak in the porous Cu specimen.


1971 ◽  
Vol 32 (C2) ◽  
pp. C2-209-C2-213 ◽  
Author(s):  
E. J. SAVINO ◽  
E. A. BISOGNI

2002 ◽  
Author(s):  
Xiao Liu ◽  
D. M. Photiadis ◽  
J. A. Bucaro ◽  
J. F. Vignola ◽  
B. H. Houston ◽  
...  

2020 ◽  
Vol 26 (S2) ◽  
pp. 2916-2917
Author(s):  
Luis Laguna Zubia ◽  
C.G. Garay-Reyes ◽  
M.A. Ruiz-Esparza-Rodriguez ◽  
J.M. Mendoza-Duarte ◽  
Ivanovich Estrada ◽  
...  

Metals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 742
Author(s):  
Motomichi Koyama ◽  
Takeaki Gondo ◽  
Kaneaki Tsuzaki

The effects of ausforming in an Fe30Mn10Cr10Co high-entropy alloy on the microstructure, hardness, and plastic anisotropy were investigated. The alloy showed a dual-phase microstructure consisting of face-centered cubic (FCC) austenite and hexagonal close-packed (HCP) martensite in the as-solution-treated condition, and the finish temperature for the reverse transformation was below 200 °C. Therefore, low-temperature ausforming at 200 °C was achieved, which resulted in microstructure refinement and significantly increased the hardness. Furthermore, plasticity anisotropy, a common problem in HCP structures, was suppressed by the ausforming treatment. This, in turn, reduced the scatter of the hardness.


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