scholarly journals Metallic point contacts formed by physical vapor deposition and chemical vapor deposition: microscopy study and point-contact spectroscopy

1997 ◽  
Vol 23 (7) ◽  
pp. 554-560
Author(s):  
N. N. Gribov ◽  
J. Caro ◽  
T. G. M. Oosterlaken ◽  
S. Radelaar
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Point Contact ◽  
Chemical Vapor ◽  
Microscopy Study ◽  
Point Contacts ◽  
Point Contact Spectroscopy

scholarly journals Welding, Joining, and Coating of Metallic Materials

Materials ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2640
Author(s):  
Michael Zinigrad ◽  
Konstantin Borodianskiy
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Metallic Substrate ◽  
Metallic Materials ◽  
Special Issue ◽  
Different Types ◽  
Recent Developments ◽  
Micro Arc Oxidation

Welding, joining, and coating of metallic materials are among the most applicable fabrication processes in modern metallurgy. Welding or joining is the manufacture of a metal one-body workpiece from several pieces. Coating is the process of production of metallic substrate with required properties of the surface. A long list of specific techniques is studied during schooling and applied in industry; several include resistant spot, laser or friction welding, micro arc oxidation (MAO), chemical vapor deposition (CVD), and physical vapor deposition (PVD), among others. This Special Issue presents 21 recent developments in the field of welding, joining, and coating of various metallic materials namely, Ti and Mg alloys, different types of steel, intermetallics, and shape memory alloys.

The Application of Wear Resistant Thin Layers for Cold Forming Tools

2014 ◽  
Vol 782 ◽  
pp. 619-622 ◽  
Author(s):  
Pavol Beraxa ◽  
Lucia Domovcová ◽  
Ľudovít Parilák
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Operating Conditions ◽  
Thin Layers ◽  
Treatment Technology ◽  
Cold Forming ◽  
Forming Tools

Along with technologies development rise demands on the technical level of new machinery and equipment and also the reliability and efficiency of tools used in the production processes. One of the options for increasing tool life and wear resistance is the use of tools surface treatment technology called as CVD (chemical vapor deposition) and PVD (Physical Vapor Deposition) process. Chemical vapor deposition is a widely used materials-processing. CVD is an atomistic surface modification process, where a thin solid coating is deposited on an underlying heated substrate via a chemical reaction from the vapor or gas phase, PVD process is atomistic deposition process in which material is vaporized from a solid or liquid source in the form of atoms or molecules, transported in the form of a vapor through a vacuum or low pressure gaseous (or plasma) environment to the substrate where it condenses. The paper introduces the possibilities of application of these processes for cold forming tools used at operating conditions of Železiarne Podbrezová, a.s. Tools (formers and straightening rolls) are evaluated in terms of CVD and PVD coating thickness, microstructure and microhardness of tool material and coating.

Atomic Force Microscopy Study of Initial Nucleation in the Deposition OF μc-Si:H

1999 ◽  
Vol 557 ◽  
Author(s):  
P. Brogueira ◽  
V. Chu ◽  
J.P. Conde
Keyword(s):  
Atomic Force Microscopy ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Microscopy Study ◽  
Dark Conductivity ◽  
Rf Plasma ◽  
Hydrogen Treatment ◽  
Force Microscopy ◽  
Atomic Force

AbstractThe initial stages of microcrystalline silicon growth of n+ doped films prepared by rf plasma enhanced chemical vapor deposition (PECVD) and of intrinsic films prepared by hot-wire chemical vapor deposition (HW-CVD) are studied using atomic force microscopy, Raman spectroscopy and parallel dark conductivity measurements. The effect of the use of a plasma hydrogen treatment, of chamber conditioning prior to this treatment, of the type of substrate (glass or c-Si) used and the effects of a seed layer on the film properties are discussed.

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