High heat flux loop heat pipes

1997 ◽  
Author(s):  
Mark T. North ◽  
David B. Sarraf ◽  
John H. Rosenfeld ◽  
Yuri F. Maidanik ◽  
Sergey Vershinin
Keyword(s):  
Heat Flux ◽  
Heat Pipes ◽  
High Heat ◽  
High Heat Flux ◽  
Loop Heat Pipes

FLAT PLATE PULSATING HEAT PIPES WITH DIFFERENT CHANNEL GEOMETRIES FOR HIGH HEAT FLUX APPLICATIONS

2020 ◽  
Author(s):  
Larissa Krambeck ◽  
Kelvin Guessi Domiciano ◽  
Luis Alonso Betancur Arboleda ◽  
Marcia Mantelli
Keyword(s):  
Heat Flux ◽  
Flat Plate ◽  
Heat Pipes ◽  
High Heat ◽  
High Heat Flux

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

2008 ◽  
Author(s):  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Thang Nguyen ◽  
Tien Nguyen ◽  
Vijit Wuttijumnong ◽  
...  
Keyword(s):  
Heat Flux ◽  
Electronic Devices ◽  
Thermal Control ◽  
High Heat ◽  
Control Device ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Total Thermal Resistance ◽  
Evaporation Zone ◽  
Loop Heat Pipes

Thermal management of laptops is becoming increasingly challenging task due to the high heat flux associated with the microprocessors and limited available space for the integration of the thermal control device inside the cabinet. In this paper, results from the investigation of two different designs of miniature Loop Heat Pipe (mLHP) for thermal control of compact electronic devices including notebooks have been discussed. Two prototypes of mLHP, one with a disk shaped evaporator of 30 mm in diameter and 10 mm thick, and the other with a rectangular shaped evaporator of 45×35 mm2 planar area and 5 mm thick, were designed to handle heat fluxes of up to 50 W/cm2. Total thermal resistance of these mLHPs lies in the range of 1 to 5 °C/W. In addition to this, two new designs of the mLHP pertaining to enhance the heat transfer inside the evaporation zone and to develop the loop evaporator with thickness as small as 3 mm are discussed. In conclusions, the designed mLHPs were able to satisfy the thermal and design requirements of the current laptop equipments and can be classified as potential candidates for cooling of the compact electronic devices with restricted space and high heat flux chipsets.

scholarly journals Design solutions for gravity-independent heat pipes

2021 ◽  
Vol 65 (2) ◽  
pp. 234-240
Author(s):  
O. L. Voitik ◽  
K. I. Delendik ◽  
N. V. Kolyago
Keyword(s):  
Heat Flux ◽  
Liquid Water ◽  
High Performance ◽  
Heat Pipes ◽  
High Heat ◽  
High Heat Flux ◽  
Capillary Structure ◽  
Deep Freezing ◽  
Working Liquid ◽  
Independent Heat

Heat pipes with mesh wicks were designed (working liquid – water, envelope – copper tube). Wicks from the mesh of various weaves (plain, twill, leno and looped) with improved hydrophilic properties and secondary capillary structure were developed. Heat pipes are gravity-independent, adapted to work in various conditions of orientation and localization, and provide the transfer of high heat flux powers (up to 25 W/cm2 ). The peculiar properties of the developed heat pipes in contrast to the traditional heat pipes (with powder wicks) are: high performance characteristics, resistance to deep freezing; vibrostability.

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