Design of cooling system for high-power LED luminaire

Author(s):  
K. Delendik ◽  
N. Kolyago ◽  
O. Voitik
2020 ◽  
Vol 23 (1) ◽  
pp. 91-101
Author(s):  
D.V. Pekur ◽  
◽  
Yu.E. Nikolaenko ◽  
V.M. Sorokin ◽  
◽  
...  

2011 ◽  
Vol 295-297 ◽  
pp. 1985-1988
Author(s):  
Yu Jun Gou ◽  
Zhong Liang Liu ◽  
Xiao Hui Zhong

A new cooling concept for high power LED by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a new type of heat pipe with specific fins structure was developed. Through experimental results, we found the new heat pipe heat exchanger has the features of high efficiency of heat dissipation and compact construction which meets the demand of heat dissipation for high power LED. We also found the heat dissipation performance of the HP heat exchanger changed with the work angle.


2010 ◽  
Vol 41 (1) ◽  
pp. 1915
Author(s):  
Mao-Yi Lee ◽  
Alex Wang ◽  
Jung-Hsien Yen ◽  
Jung-Hua Chou

2009 ◽  
Vol 29 (4) ◽  
pp. 609-616 ◽  
Author(s):  
Bin-Juine Huang ◽  
Chun-Wen Tang ◽  
Min-Sheng Wu

2019 ◽  
Vol 29 (10) ◽  
pp. 3893-3907
Author(s):  
Yuanlong Chen ◽  
Tingbo Hou ◽  
Xiaochao Zhou

Purpose The purpose of this paper is to ensure adequate thermal management to remove and dissipate the heat produced by a light-emitting diode (LED) and to guarantee reliable and safe operation. Design/methodology/approach A three-dimensional (3-D) computational fluid dynamics (CFD) model was used to analyze the distribution of fluid velocities among microchannels at four different aspect ratios. Findings The results showed that at the same inlet flow rate, the larger the aspect ratio of the microchannels, the better the uniformity of the internal fluid velocity and thus better the heat dissipation performance on the surface of the high-power LED chip. In addition, the thermal performance of a high-power LED water cooling system with four different aspect ratios’ microchannel structures is further studied experimentally. Specifically, the coupling effect between the fluid velocity distribution in the microchannels and the heat dissipation performance of a high-power LED water cooling system is qualitatively analyzed and compared with the simulation results of the fluid velocity distribution. The results fully demonstrated that a larger aspect ratio of the microchannels results in better heat dissipation performance on the surface of the high-power LED chip. Originality/value Optimizing the structural parameters to facilitate a relatively uniform velocity distribution to improve the water cooling system performance may be a key factor to be considered.


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