Stress relief by annealing under external stress in Fe-based metallic glasses

2018 ◽  
Vol 124 (16) ◽  
pp. 165108 ◽  
Author(s):  
M. C. Ri ◽  
D. W. Ding ◽  
S. Sohrabi ◽  
B. A. Sun ◽  
W. H. Wang
2003 ◽  
Vol 795 ◽  
Author(s):  
Alex A. Volinsky ◽  
Dirk C. Meyer ◽  
Tilmann Leisegang ◽  
Peter Paufler

ABSTRACTWhile there are many stress relief mechanisms observed in thin films, excessive residual and externally applied stresses cause film fracture. In the case of tensile stress a network of through-thickness cracks forms in the film. In the case of compressive stress thin film buckling is observed in the form of blisters. Thin film delamination is an inseparable phenomenon of buckling. The buckling delamination blisters can be either circular, straight, or form periodic buckling patterns commonly known as telephone cord delamination morphology.While excessive biaxial residual stress is the key for causing thin film fracture, either in tension, or compression, it is the influence of the external stress that can control the final fracture pattern. In this paper we consider phone cord buckling delamination observed in compressed W/Si and TiWN/GaAs thin film systems, as well as spiral and sinusoidal though-thickness cracks observed in Mo/Si multilayers under 3-point high-temperature bending in tension.


1977 ◽  
Vol 99 (1) ◽  
pp. 149-151
Author(s):  
L. A. Primm

This paper discusses the 1975 field results of the application of external stress relief grooves on drill collars. It contains a formula for the calculation of the groove diameter and makes recommendations for how and where to cut these features. Increased connector fatigue life was gained.


Author(s):  
J. Fang ◽  
H. M. Chan ◽  
M. P. Harmer

It was Niihara et al. who first discovered that the fracture strength of Al2O3 can be increased by incorporating as little as 5 vol.% of nano-size SiC particles (>1000 MPa), and that the strength would be improved further by a simple annealing procedure (>1500 MPa). This discovery has stimulated intense interest on Al2O3/SiC nanocomposites. Recent indentation studies by Fang et al. have shown that residual stress relief was more difficult in the nanocomposite than in pure Al2O3. In the present work, TEM was employed to investigate the microscopic mechanism(s) for the difference in the residual stress recovery in these two materials.Bulk samples of hot-pressed single phase Al2O3, and Al2O3 containing 5 vol.% 0.15 μm SiC particles were simultaneously polished with 15 μm diamond compound. Each sample was cut into two pieces, one of which was subsequently annealed at 1300° for 2 hours in flowing argon. Disks of 3 mm in diameter were cut from bulk samples.


1998 ◽  
Vol 08 (PR2) ◽  
pp. Pr2-27-Pr2-30
Author(s):  
L. Malkinski ◽  
A. Slawska-Waniewska ◽  
R. Zuberek ◽  
A. Wisniewski ◽  
H. K. Lachowicz ◽  
...  

1980 ◽  
Vol 41 (C8) ◽  
pp. C8-139-C8-140
Author(s):  
J. Hafner
Keyword(s):  

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