Meta-aramidic electrospun nanofibers as innovative wood surface flame retardants

2018 ◽  
Author(s):  
Stefano Merighi ◽  
Laura Mazzocchetti ◽  
Tiziana Benelli ◽  
Emanuele Maccaferri ◽  
Juri Belcari ◽  
...  
Keyword(s):  
Wood Surface ◽  
Flame Retardants ◽  
Electrospun Nanofibers ◽  
Surface Flame

scholarly journals A New Wood Surface Flame‐Retardant Based on Poly‐ m ‐Aramid Electrospun Nanofibers

2019 ◽  
Vol 59 (12) ◽  
pp. 2541-2549 ◽  
Author(s):  
Stefano Merighi ◽  
Laura Mazzocchetti ◽  
Tiziana Benelli ◽  
Emanuele Maccaferri ◽  
Andrea Zucchelli ◽  
...  
Keyword(s):  
Flame Retardant ◽  
Wood Surface ◽  
Electrospun Nanofibers ◽  
Surface Flame

Quality Enhancement of the Rounded Wood Surface

2017 ◽  
Vol 33 (1) ◽  
Author(s):  
Aleksandr Chemodanov ◽  
Evgenii Iamshchikov ◽  
Roman Lozhkin ◽  
Aleksandr Turuev
Keyword(s):  
Wood Surface ◽  
Quality Enhancement

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

Determination and prediction for vapor pressures of organophosphate flame retardants by gas chromatography

2017 ◽  
Vol 35 (9) ◽  
pp. 1008 ◽  
Author(s):  
Qingzhi Wang ◽  
Hongxia Zhao ◽  
Yan Wang ◽  
Qing Xie ◽  
Jingwen Chen ◽  
...  
Keyword(s):  
Gas Chromatography ◽  
Flame Retardants ◽  
Vapor Pressures
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