scholarly journals Nonlinear effects of micro-cracks on acoustic surface and wedge waves

2018 ◽  
Vol 44 (7) ◽  
pp. 744-750
Author(s):  
M. Rjelka ◽  
P. D. Pupyrev ◽  
B. Koehler ◽  
A. P. Mayer
Ultrasonics ◽  
2018 ◽  
Vol 90 ◽  
pp. 98-108 ◽  
Author(s):  
Marek Rjelka ◽  
Bernd Köhler ◽  
Andreas Mayer

2004 ◽  
Author(s):  
Riki Takeuchi ◽  
David P. Lepak ◽  
Sophia Marinova ◽  
Seokhwa Yun

1966 ◽  
Vol 90 (11) ◽  
pp. 435-489 ◽  
Author(s):  
Vadim N. Tsytovich
Keyword(s):  

1980 ◽  
Vol 130 (2) ◽  
pp. 357 ◽  
Author(s):  
T.S. Velichkina ◽  
O.I. Vasil'eva ◽  
A.N. Izrailenko ◽  
I.A. Yakovlev

2019 ◽  
pp. 77-88
Author(s):  
V.I. Dyrda ◽  
◽  
S.M. Grebenyuk ◽  
S.P. Sokol ◽  
S.B. Slobodian ◽  
...  
Keyword(s):  

2020 ◽  
Vol 38 (6A) ◽  
pp. 879-886
Author(s):  
Ahmed S. Kadhim ◽  
Alaa A. Atiyah ◽  
Shakir A. Salih

This paper aims to investigate the influence of utilization micro cement kiln dust as a sustainable materials additive in order to reduce the voids and micro cracks in the cementitious mortar materials which cause a drastic reduction in the load carrying capacity of the element. Its therefore very important to decrease the pores and enhance the mechanical strength of the cementitious composite materials. In this article, the properties of self-compacting mortar containing micro cement dust additive was experimentally assessed. Micro cement dust powder was added to the self-compacting mortar in (1, 2, 3, 4 and 5 %) percentage by weight of cement to be used as cementitious sustainable materials. The experimental results indicated that the modification and enhancement of the workability of fresh mixture and the mechanical strengths of self-compacting mortar were increased as micro cement dust additives increases. Also; the water absorption and total porosity were decreased with increases of micro cement dust powder.


Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.


Author(s):  
Natasha Mathias ◽  
Farheen Shaikh ◽  
Chirayu Thakur ◽  
Sweekrithi Shetty ◽  
Pratibha Dumane ◽  
...  

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