Impact of the rate of the additive process of forming a heavy structure deforming in creep on the development of its technological stresses

Author(s):  
Dmitry A. Parshin
2012 ◽  
Vol 3 (1) ◽  
pp. 63-73 ◽  
Author(s):  
I. Csáky ◽  
F. Kalmár

Abstract Nowadays the facades of newly built buildings have significant glazed surfaces. The solar gains in these buildings can produce discomfort caused by direct solar radiation on the one hand and by the higher indoor air temperature on the other hand. The amplitude of the indoor air temperature variation depends on the glazed area, orientation of the facade and heat storage capacity of the building. This paper presents the results of a simulation, which were made in the Passol Laboratory of University of Debrecen in order to define the internal temperature variation. The simulation proved that the highest amplitudes of the internal temperature are obtained for East orientation of the facade. The upper acceptable limit of the internal air temperature is exceeded for each analyzed orientation: North, South, East, West. Comparing different building structures, according to the obtained results, in case of the heavy structure more cooling hours are obtained, but the energy consumption for cooling is lower.


Author(s):  
Dina Becker ◽  
Steffen Boley ◽  
Rocco Eisseler ◽  
Thomas Stehle ◽  
Hans-Christian Möhring ◽  
...  

AbstractThis paper describes the interdependence of additive and subtractive manufacturing processes using the production of test components made from S Al 5356. To achieve the best possible part accuracy and a preferably small wall thickness already within the additive process, a closed loop process control was developed and applied. Subsequent machining processes were nonetheless required to give the components their final shape, but the amount of material in need of removal was minimised. The effort of minimising material removal strongly depended on the initial state of the component (wall thickness, wall thickness constancy, microstructure of the material and others) which was determined by the additive process. For this reason, knowledge of the correlations between generative parameters and component properties, as well as of the interdependency between the additive process and the subsequent machining process to tune the former to the latter was essential. To ascertain this behaviour, a suitable test part was designed to perform both additive processes using laser metal wire deposition with a closed loop control of the track height and subtractive processes using external and internal longitudinal turning with varied parameters. The so manufactured test parts were then used to qualify the material deposition and turning process by criteria like shape accuracy and surface quality.


2021 ◽  
pp. 002085232110588
Author(s):  
Tao Li ◽  
Zhenyu M. Wang

The prevalence of top-heavy bureaucracies in non-democracies cannot be explained by the theories of Parkinson, Tullock, Niskanen, or Simon or by classical managerial theories. When bureaucracy positions carry rents, the competition for promotion becomes a rent-seeking process. Borrowing the career-tournament theory framework from managerial scholarship, we argue that top-heavy bureaucracy resembles a tournament with too many finalists. When rent is centralized at the top (i.e. power centralization), as is the case in many non-democracies, the optimal bureaucracy should be top-heavy, accommodating and encouraging relatively more finalists at the top to compete for the final big prize. We provide suggestive evidence by analyzing ministry organizations in China (1993–2014) and Russia (2002–2015). After some fluctuations, the shape of Russian ministries eventually converged with that of China. In the steady state, their ministry shapes are far more top-heavy than what is prescribed by managerial theories. At the micro-level, ministry power centralization, measured by the perceived influence of the ministers, is correlated with ministry top-heaviness in Russia. Points for practitioners Our theory suggests that a top-heavy authoritarian bureaucratic structure naturally follows from a back-loaded sequential career tournament and an effort-maximizing bureaucratic leader. Our findings also suggest that Chinese and Russian ministries both converge to a highly top-heavy structure in the long run. We demonstrate that the top-heavy structure first arose during the planned-economy experiment in the Soviet Union. Our research sheds new light on public-sector reforms that aim to reduce bureaucracy top-heaviness in autocracies.


2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Andreas Förner ◽  
S. Giese ◽  
C. Arnold ◽  
P. Felfer ◽  
C. Körner ◽  
...  

Abstract Eutectic NiAl-(Cr,Mo) composites are promising high temperature materials due to their high melting point, excellent oxidation behavior and low density. To enhance the strength, hardness and fracture toughness, high cooling rates are beneficial to obtain a fine cellular-lamellar microstructure. This can be provided by the additive process of selective electron beam melting. The very high temperature gradient achieved in this process leads to the formation of the finest microstructure that has ever been reported for NiAl-(Cr,Mo) in-situ composites. A very high hardness and fracture toughening mechanisms were observed. This represents a feasibility study towards additive manufacturing of eutectic NiAl-(Cr,Mo) in-situ composites by selective electron beam melting.


2015 ◽  
Vol 72 (4) ◽  
pp. 600-607 ◽  
Author(s):  
Dong-Heui Kwak ◽  
Ki-Cheol Lee

To remove phosphorus (P) from municipal wastewater, various types of advanced treatment processes are being actively applied. However, there is commonly a space limit in municipal wastewater treatment plants (MWTPs). For that reason, the dissolved air flotation (DAF), which is well known for small space and flexible application process, is preferred as an additive process to enhance the removal of P. A series of experiments were conducted to investigate the feasibility of flotation scum recycling for effective P removal from a MWTP using a DAF pilot plant over 1 year. The average increases in the removal efficiencies due to flotation scum recycling were 22.6% for total phosphorus (T-P) and 18.3% for PO4-P. A higher removal efficiency of T-P was induced by recycling the flotation scum because a significant amount of Al components remained in the flotation scum. The increase in T-P removal efficiency, due to the recycling of flotation scum, shifted from the boundary of the stoichiometric precipitate to the equilibrium control region. Flotation scum recycling may contribute to improving the quality of treated water and reducing treatment costs by minimizing the coagulant dosage required.


JETP Letters ◽  
2005 ◽  
Vol 82 (7) ◽  
pp. 404-408 ◽  
Author(s):  
V. I. Matveev ◽  
D. U. Matrasulov ◽  
S. V. Ryabchenko
Keyword(s):  

2019 ◽  
Vol 2019 (1) ◽  
pp. 000409-000414
Author(s):  
Masaya Toba ◽  
Shuji Nomoto ◽  
Nobuhito Komuro ◽  
Kazuyuki Mitsukura ◽  
Shinichiro Abe ◽  
...  

Abstract Semiconductor packages for high performance devices with printed circuit boards having multi wiring layers such as FC-BGA have been attracting the attention in order to realize ultra-reliable and low latency communications in 5G networking. Cu wirings for the package are usually fabricated by via formation by laser for dielectric, desmear, electroless Cu seed formation, photoresist patterning, electrolytic Cu plating, resist stripping and seed layer etching. Though a desmear process can obtain enough adhesion between dielectric and Cu seed layer by anchoring effect to secure reliabilities, the interface between dielectric and Cu seed layer should be smooth to achieve low attenuation of electric signals at high frequencies. Here, instead of a desmear process, we applied an UV modification for the surface of dielectric in order to realize a smooth and high adhesive seed layer against dielectric. We obtained 0.8 kN/m of peel strength between dielectric and Cu seed layer in spite of surface roughness (Ra) of dielectric was 45 nm by nano-level anchoring effect at UV modified layer. Due to the smooth interface by UV modification, S21 value of microstrip line was 26 % improved compared to that assembled through desmear process at 60 GHz.


2018 ◽  
Vol 2018 (1) ◽  
pp. 000305-000309 ◽  
Author(s):  
Shiro Tatsumi ◽  
Shohei Fujishima ◽  
Hiroyuki Sakauchi

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.


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