scholarly journals Experimental characterization of impact ionization coefficients for electrons and holes in GaN grown on bulk GaN substrates

2018 ◽  
Vol 112 (26) ◽  
pp. 262103 ◽  
Author(s):  
Lina Cao ◽  
Jingshan Wang ◽  
Galen Harden ◽  
Hansheng Ye ◽  
Roy Stillwell ◽  
...  
Keyword(s):  
Impact Ionization ◽  
Experimental Characterization ◽  
Bulk Gan ◽  
Ionization Coefficients

Characterization of breakdown behavior of diamond Schottky barrier diodes using impact ionization coefficients

2017 ◽  
Vol 56 (4S) ◽  
pp. 04CR12 ◽  
Author(s):  
Khaled Driche ◽  
Hitoshi Umezawa ◽  
Nicolas Rouger ◽  
Gauthier Chicot ◽  
Etienne Gheeraert
Keyword(s):  
Schottky Barrier ◽  
Impact Ionization ◽  
Schottky Barrier Diodes ◽  
Ionization Coefficients

Characterization of Breakdown Behavior of Diamond SBDs using Impact Ionization Coefficients

2016 ◽  
Author(s):  
K. Driche ◽  
H. Umezawa ◽  
G. Chicot ◽  
N. Rouger ◽  
E. Gheeraert
Keyword(s):  
Impact Ionization ◽  
Ionization Coefficients

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Experimental Characterization of Mechanical Behavior of Cord-Rubber Composites

1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert
Keyword(s):  
Response Characteristic ◽  
Cord Compression ◽  
Complete Characterization ◽  
Strain Response ◽  
Strain Gages ◽  
Experimental Characterization ◽  
Rubber Composites ◽  
Stress Strain ◽  
Strain Data

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.

Turbulence ingestion noise. I - Experimental characterization of grid-generated turbulence

AIAA Journal ◽  
2002 ◽  
Vol 40 ◽  
pp. 16-25
Author(s):  
J. P. Wojno ◽  
T. J. Mueller ◽  
W. K. Blake
Keyword(s):  
Experimental Characterization
Sign in / Sign up

Export Citation Format

Share Document