Large electrocaloric efficiency over a broad temperature span in lead-free BaTiO3-based ceramics near room temperature

2017 ◽  
Vol 111 (20) ◽  
pp. 202902 ◽  
Author(s):  
Tangyuan Li ◽  
Xinyu Liu ◽  
Sheng Shi ◽  
Yihao Yin ◽  
Hongfa Li ◽  
...  
Keyword(s):  
2021 ◽  
Vol 127 (6) ◽  
Author(s):  
Hend Kacem ◽  
Ah. Dhahri ◽  
Mohamed Amara Gdaiem ◽  
Z. Sassi ◽  
L. Seveyrat ◽  
...  

2021 ◽  
Vol 871 ◽  
pp. 159519
Author(s):  
Sheng-Guo Lu ◽  
Xiongwei Lin ◽  
Jiang Li ◽  
Dandan Li ◽  
Yingbang Yao ◽  
...  

2006 ◽  
Vol 510-511 ◽  
pp. 842-845 ◽  
Author(s):  
Noriko Bamba ◽  
Kentaro Kato ◽  
Toshinori Taishi ◽  
Takayuki Hayashi ◽  
Keigo Hoshikawa ◽  
...  

Langasite (La3Ga5SiO14: denoted by LGS) single crystal is one of the lead free piezoelectric materials with high piezoelectricity that is maintained up to its melting point (1470°C). Although LGS single crystals have usually been grown by Czochralski (CZ) method in oxygen contained atmosphere to prevent evaporation of Ga, they were grown by the vertical Bridgman (VB) method in Ar atmosphere without oxygen, and their properties were evaluated in this work. Transparent and colorless LGS single crystals were successfully obtained without Ga evaporation by the VB method in Ar atmosphere, and their resistivity at room temperature was much higher than that grown by conventional CZ method. Piezoelectric constant d11 of the crystal grown by the VB method was 6 x 10-12 C/N, which was close to that of the crystal grown by CZ method. The colorless transparent LGS single crystal turned to orange and its resistivity decreased by annealing in air. Since an orange-colored transparent LGS single crystal has been grown by conventional CZ method, this indicates that color change and the resistivity decrease of LGS crystal is caused by extra interstitial oxygen atoms in the crystal.


2017 ◽  
Vol 888 ◽  
pp. 42-46 ◽  
Author(s):  
Fatin Khairah Bahanurdin ◽  
Julie Juliewatty Mohamed ◽  
Zainal Arifin Ahmad

In this research, alkaline niobate known as K0.5Na0.5NbO3 (KNN) lead-free piezoelectric ceramic was synthesis by solid state reaction method which pressing at different sintering temperatures (1000 °C and 1080 °C) prepared via hot isostatic pressing (HIP)). The effect of sintering temperature on structure and dielectric properties was studied. The optimum sintering temperature (at 1080 °C for 30 minutes) using hot isostatic pressing (HIP) was successfully increase the density, enlarge the particle grain size in the range of 0.3 µm – 2.5 µm and improves the dielectric properties of K0.5Na0.5NbO3 ceramics. The larger grain size and higher density ceramics body will contribute the good dielectric properties. At room temperature, the excellent relative permittivity and tangent loss recorded at 1 MHz (ɛr = 5517.35 and tan δ = 0.954), respectively for KNN1080HIP sample. The KNN1080HIP sample is also exhibits highest relative density which is 4.485 g/cm3. The ɛr depends upon density and in this work, the density increase as the sintering temperature increase, which resulting the corresponding ɛr value also increases.


2018 ◽  
Vol 112 (19) ◽  
pp. 193902 ◽  
Author(s):  
Haibibu Aziguli ◽  
Xin Chen ◽  
Yang Liu ◽  
Guang Yang ◽  
Ping Yu ◽  
...  

2019 ◽  
Vol 7 (10) ◽  
pp. 3003-3014 ◽  
Author(s):  
Przemysław Szklarz ◽  
Anna Gągor ◽  
Ryszard Jakubas ◽  
Piotr Zieliński ◽  
Anna Piecha-Bisiorek ◽  
...  

Novel room-temperature ferroelectric crystals with complex sequences of phase transitions.


2012 ◽  
Vol 622-623 ◽  
pp. 195-199 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
A.R. Nik Nurhidayatul Suhada ◽  
Flora Somidin ◽  
Rafezi Ahmad Khairel ◽  
C.S. Lee ◽  
...  

Electromigration effects on the solder joint formation of 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu lead-free solder with Cu electroplated Ni layer wire were investigated. The electromigration effects on the solder joints were studied after current density stressing at 1 x 103 A/cm2 in room temperature for 0 h, 120 h, and 240 h. The research work found that intermetallic compound (IMC) formation on the joint is increases for both solders with longer period of current stress applied. Higher IMC thickness growth in 99.3Sn-0.7Cu solder joint compared to 99.3Sn-0.7Cu is detected and both anode regions of the solder joints show higher IMC thickness growth compared to cathode region. Experimental results show 99.3Sn-0.7Cu solder joint is more prone to failure under current stress compared to 96.5Sn-3.0Ag-0.5Cu solder joint with thicker IMC which translates to higher brittleness.


2017 ◽  
Vol 46 (6) ◽  
pp. 3367-3372 ◽  
Author(s):  
L. T. H. Thanh ◽  
N. B. Doan ◽  
N. Q. Dung ◽  
L. V. Cuong ◽  
L. H. Bac ◽  
...  

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