Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect
2020 ◽
Vol 45
(4)
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pp. 319-332
2019 ◽
Vol 216
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pp. 301-314
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Keyword(s):
2007 ◽
Vol 34
(9-10)
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pp. 1048-1055
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2019 ◽
Vol 1270
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pp. 012028
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Keyword(s):
2009 ◽
Vol 33
(11)
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pp. 900-908