scholarly journals The motion of a 3D toroidal bubble and its interaction with a free surface near an inclined boundary

2016 ◽  
Vol 28 (12) ◽  
pp. 122101 ◽  
Author(s):  
Y. L. Liu ◽  
Q. X. Wang ◽  
S. P. Wang ◽  
A. M. Zhang
Keyword(s):  
Free Surface ◽  
Toroidal Bubble

scholarly journals Crown formation from a cavitating bubble close to a free surface

2021 ◽  
Vol 926 ◽  
Author(s):  
Youssef Saade ◽  
Maziyar Jalaal ◽  
Andrea Prosperetti ◽  
Detlef Lohse
Keyword(s):  
Free Surface ◽  
Pressure Ratio ◽  
Free Software ◽  
Control Parameters ◽  
Flow Focusing ◽  
The Third ◽  
Toroidal Bubble ◽  
Crown Formation ◽  
Highly Correlated ◽  
Curved Interface

A rapidly growing bubble close to a free surface induces jetting: a central jet protruding outwards and a crown surrounding it at later stages. While the formation mechanism of the central jet is known and documented, that of the crown remains unsettled. We perform axisymmetric simulations of the problem using the free software program BASILISK, where a finite-volume compressible solver has been implemented, which uses a geometric volume-of-fluid (VoF) method for the tracking of the interface. We show that the mechanism of crown formation is a combination of a pressure distortion over the curved interface, inducing flow focusing, and of a flow reversal, caused by the second expansion of the toroidal bubble that drives the crown. The work culminates in a parametric study with the Weber number, the Reynolds number, the pressure ratio and the dimensionless bubble distance to the free surface as control parameters. Their effects on both the central jet and the crown are explored. For high Weber numbers, we observe the formation of weaker ‘secondary crowns’, highly correlated with the third oscillation cycle of the bubble.

The bursting of a toroidal bubble at a free surface

2015 ◽  
Vol 109 ◽  
pp. 611-622 ◽  
Author(s):  
Shiping Wang ◽  
Wenyang Duan ◽  
Qianxi Wang
Keyword(s):  
Free Surface ◽  
Toroidal Bubble

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Sign in / Sign up

Export Citation Format

Share Document