scholarly journals Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

2016 ◽  
Author(s):  
Nisrin Adli ◽  
Nurul Razliana Abdul Razak ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
Intermetallic Compound ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

2017 ◽  
Vol 728 ◽  
pp. 992-1001 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

2018 ◽  
Vol 273 ◽  
pp. 27-33 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
M.S.S. Yusof ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rita Mohd Said ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compound ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Alloying Additions ◽  
Wetting Properties ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound ◽  
Free Solder ◽  
Intermetallic Layers

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary Cu6Sn5become smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and Cu6Sn5.

Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders

2015 ◽  
Vol 1120-1121 ◽  
pp. 466-472
Author(s):  
Anett Gyenes ◽  
Erzsébet Nagy ◽  
Péter Lanszki ◽  
Zoltán Gácsi
Keyword(s):  
Intermetallic Compound ◽  
Nickel Content ◽  
Lead Free ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Eutectic Formation ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders ◽  
Ppm Level

In this study the effects of small amounts of nickel addition (0-2000 ppm) on the microstructure, on Cu6Sn5 intermetallic compound formation and the mechanical properties of a Sn-0.5Cu lead-free solder were investigated. It is known that even ppm level additions of Ni have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphology evolution from hypoeutectic through fully eutectic to hypereutectic. Furthermore, the presence of Ni in the Cu6Sn5 intermetallic compound phase stabilises its high-temperature allotrope η-Cu6Sn5.

Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

2012 ◽  
Vol 501 ◽  
pp. 160-164 ◽  
Author(s):  
Iziana Yahya ◽  
Noor Asikin Ab Ghani ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Hamidi Abd Hamid ◽  
Zainal Arifin Ahmad ◽  
...  
Keyword(s):  
Powder Metallurgy ◽  
Raw Materials ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
X Ray Diffraction ◽  
Copper Powders ◽  
Micron Size ◽  
Free Solder

The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.

The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method

2016 ◽  
Vol 857 ◽  
pp. 13-17 ◽  
Author(s):  
Nisrin Adli ◽  
Nurul Razliana Abdul Razak ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
Melting Point ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
Zn Addition ◽  
The World ◽  
Zinc Addition ◽  
Free Solder ◽  
Lead Free Solders

The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful SnPb solders. The effects of Zn addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder were investigated with 1 wt% and 5 wt% of Zn additions. Powder metallurgy (PM) method was used to fabricate these Sn-0.7Cu-Zn lead-free solders. The results revealed that the addition of Zn was able to improve the solder properties. The melting point of Sn-0.7Cu-Zn lead-free solder was decreased drastically as the increasing of Zn additions. The Zn particles were distributed homogenously along the grain boundaries and produced refined dendrite β-Sn, which also lead to a superior microhardness values of solders.

Sign in / Sign up

Export Citation Format

Share Document