Atomistic modelling of evaporation and explosive boiling of thin film liquid argon over internally recessed nanostructured surface

2016 ◽  
Author(s):  
Mohammad Nasim Hasan ◽  
Sheikh Mohammad Shavik ◽  
Kazi Fazle Rabbi ◽  
Mominul Haque
Keyword(s):  
Thin Film ◽  
Liquid Argon ◽  
Nanostructured Surface ◽  
Explosive Boiling ◽  
Atomistic Modelling

Molecular Dynamics Simulation of Explosive Boiling on Concave Nanostructured Surface

2018 ◽  
Author(s):  
Pengfei Ji ◽  
Mengzhe He ◽  
Yiming Rong ◽  
Yuwen Zhang ◽  
Yong Tang
Keyword(s):  
Surface Area ◽  
Flat Surface ◽  
Liquid Argon ◽  
Copper Surface ◽  
Heat Transfer Process ◽  
Dynamics Simulation ◽  
Nanostructured Surface ◽  
Explosive Boiling ◽  
Nanostructured Surfaces ◽  
Set Up

Explosive boiling occurs when a liquid film contacts with the wall at extremely high temperature, which is detrimental to continuous heat transfer process. In this paper, five kinds of nanostructured surfaces with equal distance between neighboring nano-concaves and flat surface are set up to study the explosive boiling of liquid argon on copper surface. For all the five cases with concave nanostructured surface, the ratio of concave nanostructured surface area to flat surface area is kept as a constant. The temporal and spatial distributions of temperature, atomic motion and number density are recorded to study the effects of different nanostructured surface designs on explosive boiling. From the perspective of reducing explosive boiling, the most favorable nanostructured surface is determined.

scholarly journals Effect of the Hybrid Hydrophobic-Hydrophilic Nanostructured Surface on Explosive Boiling

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 212
Author(s):  
Ming-Jun Liao ◽  
Li-Qiang Duan
Keyword(s):  
Liquid Film ◽  
Coating Thickness ◽  
Bubble Nucleation ◽  
Onset Temperature ◽  
Dynamics Simulation ◽  
Hydrophilic Surface ◽  
Pillar Width ◽  
Nanostructured Surface ◽  
Explosive Boiling ◽  
Hydrophobic Coating

The influence of different wettability on explosive boiling exhibits a significant distinction, where the hydrophobic surface is beneficial for bubble nucleation and the hydrophilic surface enhances the critical heat flux. Therefore, to receive a more suitable surface for the explosive boiling, in this paper a hybrid hydrophobic–hydrophilic nanostructured surface was built by the method of molecular dynamics simulation. The onset temperatures of explosive boiling with various coating thickness, pillar width, and film thicknesses were investigated. The simulation results show that the hybrid nanostructure can decrease the onset temperature compared to the pure hydrophilic surface. It is attributed to the effect of hydrophobic coating, which promotes the formation of bubbles and causes a quicker liquid film break. Furthermore, with the increase of the hydrophobic coating thickness, the onset temperature of explosive boiling decreases. This is because the process of heat transfer between the liquid film and the hybrid nanostructured surface is inevitably enhanced. In addition, the onset temperature of explosive boiling on the hybrid wetting surface decreases with the increase of pillar width and liquid film thickness.

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

2015 ◽  
Author(s):  
Sheikh Mohammad Shavik ◽  
Mohammad Nasim Hasan ◽  
A. K. M. Monjur Morshed
Keyword(s):  
Molecular Dynamics ◽  
Liquid Film ◽  
Solid Surface ◽  
Solid Wall ◽  
Thin Liquid Film ◽  
Liquid Argon ◽  
Spatial And Temporal Variation ◽  
Phase System ◽  
Explosive Boiling ◽  
System Pressure

Molecular dynamics (MD) simulations have been performed to investigate the boiling phenomena of thin liquid film adsorbed on a nanostructured solid surface with particular emphasis on the effect of wetting condition of the solid surface. The molecular system consists of liquid and vapor argon, and solid platinum wall. The nanostructures which reside on top of the solid wall have shape of rectangular block. The solid-liquid interfacial wettability, in other words whether the solid surface is hydrophilic or hydrophobic has been altered for different cases to examine its effect on boiling phenomena. The initial configuration of the simulation domain comprised a three phase system (solid platinum, liquid argon and vapor argon) which was equilibrated at 90 K. After equilibrium period, the wall temperature was suddenly increased from 90 K to 250 K which is far above the critical point of argon and this initiates rapid or explosive boiling. The spatial and temporal variation of temperature and density as well as the variation of system pressure with respect to time were closely monitored for each case. The heat flux normal to the solid surface was also calculated to illustrate the effectiveness of heat transfer for different cases of wetting conditions of solid surface. The results show that the wetting condition of surface has significant effect on explosive boiling of the thin liquid film. The surface with higher wettability (hydrophilic) provides more favorable conditions for boiling than the low-wetting surface (hydrophobic) and therefore, liquid argon responds quickly and shifts from liquid to vapor phase faster in case of hydrophilic surface.

Molecular Dynamics Simulation of Normal and Explosive Boiling on Nanostructured Surface

2013 ◽  
Vol 135 (12) ◽  
Author(s):  
Hamid Reza Seyf ◽  
Yuwen Zhang
Keyword(s):  
Thin Film ◽  
Molecular Dynamics ◽  
Evaporation Rate ◽  
Solid Wall ◽  
Molecular System ◽  
Spherical Shape ◽  
Dynamics Simulation ◽  
Spherical Particles ◽  
Explosive Boiling ◽  
Higher Temperature

Molecular Dynamics (MD) simulation is carried out to investigate the normal and explosive boiling of thin film adsorbed on a metal substrate whose surface is structured by an array of nanoscale spherical particles. The molecular system is comprised of the liquid and vapor argon as well as a copper wall. The nanostructures have spherical shape with uniform diameters while the thickness of liquid film is constant. The effects of transvers and longitudinal distances as well as the diameter of nanoparticles are analyzed. The simulation is started from an initial configuration for three phases (liquid argon, vapor argon and solid wall); after equilibrating the system at 90 K, the wall is heated suddenly to a higher temperature that is well beyond the critical temperature of argon. Two different superheat degrees are selected: a moderately high temperature of 170 K for normal evaporation and much higher temperature 290 K for explosive boiling. By monitoring the space and time dependences of temperature and density as well as net evaporation rate, the normal and explosive boiling process on a flat surface with and without nanostructures are investigated. The results show that the nanostructure has significant effect on evaporation/boiling of thin film. The degrees of superheat and size of nanoparticles have significant effects on the trajectories of particles and net evaporation rate. For the cases with nanostructure, liquid responds very quickly and the number of evaporation molecules increases with increasing the size of particles from 1 to 2 nm while it decreases for d = 3 nm.

scholarly journals Thermal transport during thin-film argon evaporation over nanostructured platinum surface: A molecular dynamics study

2018 ◽  
Vol 232 (2-3) ◽  
pp. 83-91
Author(s):  
Mohammad Nasim Hasan ◽  
Sheikh Mohammad Shavik ◽  
Kazi Fazle Rabbi ◽  
Khaled Mosharraf Mukut ◽  
Md. Muntasir Alam
Keyword(s):  
Thin Film ◽  
Molecular Dynamics ◽  
Thermal Transport ◽  
Molecular System ◽  
Dynamics Simulation ◽  
Sudden Increase ◽  
Nanostructured Surface ◽  
Surface Wetting ◽  
Platinum Surface ◽  
Fluid Interaction

Investigation of thermal transport characteristics of thin-film liquid evaporation over nanostructured surface has been conducted using molecular dynamics simulation with particular importance on the effects of the nanostructure configuration for different wall–fluid interaction strengths. The nanostructured surface considered herein comprises wall-through rectangular nanoposts placed over a flat wall. Both the substrate and the nanostructure are of platinum while argon is used as the evaporating liquid. Two different wall–fluid interaction strengths have been considered that essentially emulate both hydrophilic and hydrophobic wetting conditions for three different nanostructure configurations. The argon–platinum molecular system is first equilibrated at 90 K and then followed by a sudden increase in the wall temperature at 130 K that induces evaporation of argon laid over it. Comparative effectiveness of heat and mass transfer for different surface wetting conditions has been studied by calculating the wall heat flux and evaporative mass flux. The results obtained in this study show that heat transfer occurs more easily in cases of nanostructured surfaces than in case of flat surface. Difference in behavior of argon molecules during and after the evaporation process, that is, wall adsorption characteristics, has been found to depend on the surface wetting condition as well as on presence and configuration of nanostructure. A thermodynamic approach of energy balance shows reasonable agreement with the present molecular dynamics study.

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