Synthesis of large scale graphene oxide using plasma enhanced chemical vapor deposition method and its application in humidity sensing

2016 ◽  
Vol 119 (10) ◽  
pp. 103301 ◽  
Author(s):  
Yang Liu ◽  
Yuming Chen
Keyword(s):  
Graphene Oxide ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Large Scale ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Deposition Method ◽  
Humidity Sensing

Optical performance and growth mechanism of a 2D WS2–MoWS2 hybrid heterostructure fabricated by a one-step CVD strategy

CrystEngComm ◽  
2020 ◽  
Vol 22 (4) ◽  
pp. 660-665 ◽  
Author(s):  
Fei Chen ◽  
Yi Yao ◽  
Weitao Su ◽  
Su Ding ◽  
Li Fu
Keyword(s):  
Chemical Vapor Deposition ◽  
Growth Mechanism ◽  
Vapor Deposition ◽  
Large Scale ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Deposition Method ◽  
Optical Performance ◽  
One Step

A large-scale 2D WS2-Mo1−xWxS2 hybrid heterostructure can be realized by the reaction of S powder and sputtered Mo/W films through the chemical vapor deposition method.

ZnO single microwire homojunction light emitting diode grown by electric field assisted chemical vapor deposition

2015 ◽  
Vol 3 (18) ◽  
pp. 4678-4682 ◽  
Author(s):  
Qiu-Ju Feng ◽  
Hong-Wei Liang ◽  
Yi-Ying Mei ◽  
Jia-Yuan Liu ◽  
C. C. Ling ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Electric Field ◽  
Vapor Deposition ◽  
Large Scale ◽  
Light Emitting Diode ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Deposition Method ◽  
Light Emitting

A single large-scale ZnO microwire (MW) homojunction LED is fabricated by an electric field assisted chemical vapor deposition method.

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

Sign in / Sign up

Export Citation Format

Share Document