Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat

2015 ◽  
Vol 107 (25) ◽  
pp. 253903 ◽  
Author(s):  
J. W. Palko ◽  
C. Zhang ◽  
J. D. Wilbur ◽  
T. J. Dusseault ◽  
M. Asheghi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Low Superheat

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

2021 ◽  
Author(s):  
Noriyuki Unno ◽  
Kazuhisa Yuki ◽  
Risako Kibushi ◽  
Rika Nogita ◽  
Atsuyuki Mitani
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Electronic Devices ◽  
High Heat ◽  
Experimental Result ◽  
High Heat Flux ◽  
Promising Technique ◽  
Cooling Device ◽  
Cooling Devices

Abstract Boiling heat transfer (BHT) is a promising technique to remove a high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a big problem in BHT because it restricts the maximum performance of the cooling devices using BHT. Nanofluid has been widely used to improve the CHF. In this study, the authors investigated the BHT of a compact cooling device at low pressure using a special nanofluid: that is made with partially soluble particles in water. The experimental result found that the CHF with the special nanofluid is 170 W/cm2 and is higher than that with nanofluid made with an insoluble nanoparticle.

scholarly journals A Study on the Boiling Heat Transfer from Flat Surfaces under High Heat Flux : 1st Report, Burnout Heat Flux

1962 ◽  
Vol 28 (189) ◽  
pp. 587-595
Author(s):  
Seikan ISHIGAI ◽  
Kiyoshi INOUE ◽  
Akiharu KAWABATA ◽  
Yutaka SADAMORI ◽  
Zyumei KIWAKI ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
High Heat ◽  
High Heat Flux ◽  
Flat Surfaces

A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

2016 ◽  
Vol 8 (4) ◽  
Author(s):  
Olubunmi Popoola ◽  
Ayobami Bamgbade ◽  
Yiding Cao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Numerical Model ◽  
Performance Optimization ◽  
Numerical Study ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Transfer Device

An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.

Transient Pool Boiling Heat Transfer—Part 1: Incipient Boiling Superheat

1977 ◽  
Vol 99 (4) ◽  
pp. 547-553 ◽  
Author(s):  
A. Sakurai ◽  
M. Shiotsu
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Natural Convection ◽  
Boiling Point ◽  
Boiling Heat Transfer ◽  
High Heat ◽  
The Other ◽  
High Heat Flux ◽  
The Heat Transfer Coefficient

Incipient boiling superheat for exponentially increasing heat inputs to a platinum wire supported horizontally in a pool of water was measured for exponential periods ranging from 5 ms to 10 s and for subcoolings ranging from 25 to 75K under atomospheric pressure. The heat transfer coefficient before the initiation of boiling was related to those by conduction and by natural convection. The heat flux at the incipient boiling point increased with the decrease in the period. The log-log plot of the heat flux against the superheat at the incipient boiling point had a single asymptotic line of slope 2 which was independent of subcoolings in the high heat flux region. On the other hand, as the heat flux decreased to zero, the superheat tended to approach to a constant value for each subcooling. This asymptotic superheat at zero heat flux was higher for higher subcooling. Transient incipient boiling superheat was reasonably explained by the combination of two kinds of incipient boiling models.

scholarly journals Effect of Pressure on the Performance of Passive Two-Phase Closed Thermosyphon System Using R-134a

2020 ◽  
Vol 7 (1) ◽  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Heating Load ◽  
R 134A ◽  
The Heat Transfer Coefficient

Two-phase closed thermosiphon system for cooling high heat flux electronic devices was constructed and tested on a lab scale. The performance of the thermosyphon system was investigated using R-134a as a working fluid. The effect of heat flux and the refrigerant pressure on the evaporator side heat transfer coefficient were investigated. It was found that the heat transfer coefficient increases by increasing the heat flux on the evaporator or by reducing the inside pressure. The effect of heat transfer mode of the condenser (natural or forced) also affected the overall heat transfer coefficient in the cycle. At the 200W heating load, the values of the heat transfer coefficients were 32 and 1.5 kW/m². ˚C, for natural and forced convection modes, respectively. The temperature difference between the evaporator and the refrigerant saturation pressure was found to be dependent on heat flux and the pressure inside the system. At 40 W heating load, the heat transfer coefficient was calculated to be 500, 3000 and 7300 W/oC.m2 at 0.152, .135 and 0.117 reduced pressure, respectively. It can be concluded that such a thermosyphon system can be used to cool high heat flux devices. This can be done using an environmentally friendly refrigerant and without any need for power to force the convection at the condenser.

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