Potential drop strain measurement for creep monitoring

2015 ◽  
Author(s):  
Joseph Corcoran ◽  
Catrin M. Davies ◽  
Peter B. Nagy ◽  
Peter Cawley
2016 ◽  
Vol 110 ◽  
pp. 190-200 ◽  
Author(s):  
Joseph Corcoran ◽  
Paul Hooper ◽  
Catrin Davies ◽  
Peter B. Nagy ◽  
Peter Cawley

2011 ◽  
Author(s):  
E. Madhi ◽  
P. B. Nagy ◽  
Donald O. Thompson ◽  
Dale E. Chimenti

Author(s):  
Joseph Corcoran ◽  
Catrin Davies ◽  
Peter Nagy ◽  
Peter Cawley

Creep is a high temperature damage mechanism of interest to the power industry and at present lacks a satisfactory monitoring technique. Existing material inspection techniques are extremely laborious while strain measurements rely on often infrequent off-load measurements. A quasi-DC directional potential drop technique is presented that is shown at both room temperature and at high temperature to act as a robust strain gauge. Resistivity changes that are expected to occur in high temperature environments are also discussed as a source of potential error in strain measurements.


2011 ◽  
Author(s):  
E. Madhi ◽  
G. Sposito ◽  
C. M. Davies ◽  
P. Cawley ◽  
P. B. Nagy ◽  
...  

Author(s):  
Philip D. Hren

The pattern of bend contours which appear in the TEM image of a bent or curled sample indicates the shape into which the specimen is bent. Several authors have characterized the shape of their bent foils by this method, most recently I. Bolotov, as well as G. Möllenstedt and O. Rang in the early 1950’s. However, the samples they considered were viewed at orientations away from a zone axis, or at zone axes of low symmetry, so that dynamical interactions between the bend contours did not occur. Their calculations were thus based on purely geometric arguments. In this paper bend contours are used to measure deflections of a single-crystal silicon membrane at the (111) zone axis, where there are strong dynamical effects. Features in the bend contour pattern are identified and associated with a particular angle of bending of the membrane by reference to large-angle convergent-beam electron diffraction (LACBED) patterns.


1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.


Author(s):  
Y.P. Manshin ◽  
◽  
E.Yu. Manshina ◽  

The article considers an algorithm for analyzing the results of field strain-measurement studies of machine structures, which allows obtaining data for the modernization of elements in the form of coefficients of parameter changes. As the object of application of the method, the design element of the header was selected, which had failures due to insufficient endurance under cyclic bending stresses.


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