scholarly journals Transient heat transfer analysis of Pb(Zr,Ti)O3 thin film infrared sensor using finite element model

2015 ◽  
Author(s):  
Koji Oishi ◽  
Shota Yonemaru ◽  
Daisuke Akai ◽  
Makoto Ishida
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
Heat Transfer Analysis ◽  
Transient Heat Transfer ◽  
Infrared Sensor

scholarly journals Heat Transfer Analysis in Cavity of Scroll Compressor Under Clearance Leakage Flow Based on Symlet Wavelet Finite Element Method

2020 ◽  
Author(s):  
Bin Zhao ◽  
Haoyang Song ◽  
Diankui Gao ◽  
Lizhi Xu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
Heat Transfer Analysis ◽  
Transfer Model ◽  
Leakage Flow ◽  
Scroll Compressor ◽  
Eddy Simulation ◽  
Wavelet Finite Element Method

Abstract In order to improve the computational precision and efficiency of heat transfer of cavity medium of scroll compressor, the Symlet wavelet 10 finite element model is constructed by using the Symlet wavelet 10 function as interpolation function. The heat transfer model of cavity medium of scroll compressor under leakage flow is constructed based on large eddy simulation technology. Heat transfer analysis of cavity medium of scroll compressor is analyzed based on theoretical and experimental analysis. Results show that the Symlet wavelet 10 finite element model has higher precision and higher efficiency than the other two simulations. In addition, the influences of axis meshing clearance and radial meshing clearance on temperature of cavity medium of scroll compressor are discussed, the temperature of cavity medium of scroll compressor increases with axis meshing clearance and radial meshing clearance. The theoretical results can provide the favorable guidance for optimal design and operation of scroll compressor.

Numerical study of heat transfer characteristics in positional wire and arc additive manufacturing

2020 ◽  
Vol 26 (9) ◽  
pp. 1627-1635
Author(s):  
Dongqing Yang ◽  
Jun Xiong ◽  
Rong Li
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Additive Manufacturing ◽  
Temperature Distribution ◽  
Finite Element Model ◽  
Heat Dissipation ◽  
Element Model ◽  
Heat Transfer Characteristics ◽  
Content Type ◽  
Thin Walled

Purpose This paper aims to fabricate inclined thin-walled components using positional wire and arc additive manufacturing (WAAM) and investigate the heat transfer characteristics of inclined thin-walled parts via finite element analysis method. Design/methodology/approach An inclined thin-walled part is fabricated in gas metal arc (GMA)-based additive manufacturing using a positional deposition approach in which the torch is set to be inclined with respect to the substrate surface. A three-dimensional finite element model is established to simulate the thermal process of the inclined component based on a general Goldak double ellipsoidal heat source and a combined heat dissipation model. Verification tests are performed based on thermal cycles of locations on the substrate and the molten pool size. Findings The simulated results are in agreement with experimental tests. It is shown that the dwell time between two adjacent layers greatly influences the number of the re-melting layers. The temperature distribution on both sides of the substrate is asymmetric, and the temperature peaks and temperature gradients of points in the same distance from the first deposition layer are different. Along the deposition path, the temperature distribution of the previous layer has a significant influence on the heat dissipation condition of the next layer. Originality/value The established finite element model is helpful to simulate and understand the heat transfer process of geometrical thin-walled components in WAAM.

Thermal Reliability Design and Optimization for Multilayer Composite Electronic Boards

2005 ◽  
Author(s):  
Amir Khalilollahi ◽  
Russell L. Warley ◽  
Oladipo Onipede
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Stress Intensity ◽  
Finite Element Model ◽  
Element Model ◽  
Fe Model ◽  
Transfer Coefficients ◽  
Thermal Reliability ◽  
Irreversible Damage ◽  
Heat Transfer Coefficients

Boards made of composites are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and studied for the models possessing two and there laminates with different fiber orientations, and inter-fiber angles. Appreciable differences in values of max stress intensity were observed as the fiber orientation and inter-fiber angle changed. The angular parameters in this study were guided by experimental design (DOE) concepts leading to a metamodel of the stress intensity in the board. The optimum design variables found by the equations of the metamodel.

Modeling and experimental analysis of the hyperelastic thin film nitinol

2011 ◽  
Vol 22 (17) ◽  
pp. 2045-2051 ◽  
Author(s):  
Youngjae Chun ◽  
Po-Yu Lin ◽  
Hsin-Yun Chang ◽  
Michael C. Emmons ◽  
K.P. Mohanchandra ◽  
...  
Keyword(s):  
Thin Film ◽  
Finite Element ◽  
Finite Element Model ◽  
Large Deformation ◽  
Experimental Analysis ◽  
Electronic Devices ◽  
Element Model ◽  
Elastic Response ◽  
Geometric Factors ◽  
Parametric Studies

Many flexible electronic devices or endovascular biomedical devices require large deformation; however, potential materials produce limited elastic response, that is, 10% when 400% is required. In this article, a finite element model is used to design a hyperelastic thin film nitinol structure containing geometric fenestrations. The hyperelastic response is dependent upon geometric factors that produce buckling. Parametric studies provide the influence-specific parameters have on buckling load. These results are used to select three designs to manufacture and test. Experimental results indicate that elongations greater than 700% are possible.

Analysis of Heat Transfer Process and the Finite Element Model of the 10kV Three-Core Pipe Cables

2014 ◽  
Vol 1008-1009 ◽  
pp. 583-587
Author(s):  
Rui Bo Su ◽  
Peng Wang ◽  
Gang Liu ◽  
Peng Yu Wang
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Model ◽  
Transfer Process ◽  
Element Model ◽  
Heat Transfer Process ◽  
Two Dimensional ◽  
Field Equations ◽  
Simulated Calculation ◽  
The Finite Element Model

This paper first describes a variety of heat transfer which exists in cable’s discharge pipe laying process, and analyzes the entire heat transfer process of 10kV three core cable in a two-dimensional interface qualitatively according to the heat transfer ways. Meanwhile, a finite element model of 10kV three-core cable’s discharged pipe-laying is established, and its temperature field equations and boundary condition equations has been discussed. Finally, we get the heat transfer process of the three core cable’s pipe-laying discharged and a finite element model which can be applied to simulated calculation.

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