Thickness dependence of Young's modulus and residual stress of sputtered aluminum nitride thin films

2014 ◽  
Vol 105 (20) ◽  
pp. 201912 ◽  
Author(s):  
M. Schneider ◽  
A. Bittner ◽  
U. Schmid
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Aluminum Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Thickness Dependence

Microbridge Testing of Thin Films Under Small Deformation

1999 ◽  
Vol 594 ◽  
Author(s):  
T. Y. Zhang ◽  
Y. J. Su ◽  
C. F. Qian ◽  
M. H. Zhao ◽  
L. Q. Chen
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Small Deformation ◽  
Nitride Film ◽  
Silicon Nitride Film ◽  
Pressure Chemical

AbstractThe present work proposes a novel microbridge testing method to simultaneously evaluate the Young's modulus, residual stress of thin films under small deformation. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection versus load, considering both substrate deformation and residual stress in the film. Silicon nitride films fabricated by low pressure chemical vapor deposition on silicon substrates are tested to demonstrate the proposed method. The results show that the Young's modulus and residual stress for the annealed silicon nitride film are respectively 202 GPa and 334.9 MPa.

scholarly journals Young's modulus and residual stress of GeSbTe phase-change thin films

2015 ◽  
Vol 592 ◽  
pp. 69-75 ◽  
Author(s):  
Hammad Nazeer ◽  
Harish Bhaskaran ◽  
Léon A. Woldering ◽  
Leon Abelmann
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Phase Change ◽  
Young’S Modulus ◽  
Young's Modulus

Thickness Dependence of the Young’s Modulus of Polymer Thin Films

2018 ◽  
Vol 51 (17) ◽  
pp. 6764-6770 ◽  
Author(s):  
Jooyoung Chang ◽  
Kamil B. Toga ◽  
Joseph D. Paulsen ◽  
Narayanan Menon ◽  
Thomas P. Russell
Keyword(s):  
Thin Films ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Polymer Thin Films ◽  
Thickness Dependence

Microfabricated structures for theinsitumeasurement of residual stress, Young’s modulus, and ultimate strain of thin films

1987 ◽  
Vol 51 (4) ◽  
pp. 241-243 ◽  
Author(s):  
Mark G. Allen ◽  
Mehran Mehregany ◽  
Roger T. Howe ◽  
Stephen D. Senturia
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Ultimate Strain

Mechanical testing and microstructural characterisation of TiN thin films

1997 ◽  
Vol 505 ◽  
Author(s):  
A. Karimi ◽  
O. R. Shojaei ◽  
J. L. Martin
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Titanium Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Bulge Test ◽  
Tin Films ◽  
Deposition Parameters

ABSTRACTMechanical properties of titanium nitride (TiNx) thin films have been investigated using the bulge test and the depth sensing nanoindentation measurements. The bulge test was performed on the square free standing membranes made by means of standard micromachining of silicon wafers, while the nanoindentation was conducted on the films adhered to their supporting substrate. Thin layeres of titanium nitride (t = 300 – 1000 nm) were deposited in a r. f. magnetron sputtering system on the Si(100) wafers containing a layer of low stress LPCVD silicon nitride (SiNy). The bulge test was first conducted on the silicon nitride film to determine its proper residual stress and Young's modulus. Then, the composite membrane made of TiNx together with underlying silicon nitride was bulged and the related load-displacement variation was measured. Finally, using a simple rule of mixture formula the elastic mechanical properties of TiNx coatings were calculated. Both the Young's modulus and residual stress showed increasing values with negative bias voltage and nitrogen to titanium ratio, but the substrate temperature between 50–570°C was found less significant as compared to the other parameters. Nanoindentation data extracted from dynamically loading-unloading of TiN films converged to the bulge test measurements for compact coatings, but diverged from the bulge test data for porous coatings. Scanning electron microscopy observation of the cross sectioned specimens showed that TiN films first grow by formation of the nanocrystallites of size mostly between 10 – 15 nm. These nanocrystallites give rise to the columnar morphology beyond a thickness of 50–100 nm. The columns change their aspect with deposition parameters, but remain nearly perpendicular to the film surface. Relationship between microstructural evolution of columns and mechanical properties of coatings are discussed in terms of deposition parameters.

Examination of Bulge Test for Determining Residual Stress, Young’s Modulus, and Poisson’s Ratio of 3C-SiC Thin Films

2003 ◽  
Vol 16 (2) ◽  
pp. 46-54 ◽  
Author(s):  
Jay S. Mitchell ◽  
Christian A. Zorman ◽  
Thomas Kicher ◽  
Shuvo Roy ◽  
Mehran Mehregany
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Poisson's Ratio ◽  
Bulge Test
Sign in / Sign up

Export Citation Format

Share Document