Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing

2014 ◽  
Vol 116 (5) ◽  
pp. 054909 ◽  
Author(s):  
Z. H. Zhang ◽  
H. J. Cao ◽  
M. Y. Li ◽  
Y. Wang ◽  
Z. Q. Liu
Keyword(s):  
Cu6sn5 Phase ◽  
Current Stressing

Degradation properties of MOVPE-grown GaInP/GaAs HBTs under combined temperature and current stressing

2001 ◽  
Vol 41 (8) ◽  
pp. 1103-1108 ◽  
Author(s):  
Joachim Würfl ◽  
Paul Kurpas ◽  
Frank Brunner ◽  
Michael Mai ◽  
Matthias Rudolph ◽  
...  
Keyword(s):  
Current Stressing ◽  
Degradation Properties

A real-time C-V measurement circuit for MOS capacitors under current stressing

1991 ◽  
Vol 40 (4) ◽  
pp. 775-777
Author(s):  
Chung Len Lee ◽  
Tan Fu Lei ◽  
Jaw Huang Ho ◽  
Wen Tong Wang
Keyword(s):  
Real Time ◽  
Measurement Circuit ◽  
Mos Capacitors ◽  
Current Stressing

Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

2010 ◽  
Vol 26 (8) ◽  
pp. 737-742 ◽  
Author(s):  
X.J. Wang ◽  
Q.L. Zeng ◽  
Q.S. Zhu ◽  
Z.G. Wang ◽  
J.K. Shang
Keyword(s):  
Solder Joints ◽  
Shear Properties ◽  
Current Stressing

scholarly journals Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing

2013 ◽  
Vol 3 (1) ◽  
Author(s):  
Shih-kang Lin ◽  
Chao-kuei Yeh ◽  
Wei Xie ◽  
Yu-chen Liu ◽  
Masahiro Yoshimura
Keyword(s):  
Binary System ◽  
Ab Initio ◽  
Thermodynamic Modeling ◽  
Current Stressing

Sub-100 μm SnAg Solder Bumping Technology and the Bump Reliability

2009 ◽  
Vol 131 (1) ◽  
Author(s):  
Xiaoqin Lin ◽  
Le Luo
Keyword(s):  
Cu6sn5 Phase ◽  
X Ray ◽  
Solder Bumps ◽  
Average Shear Strength ◽  
Average Shear ◽  
Snag Solder ◽  
Packaging Industry ◽  
Negative Impacts ◽  
Free Solder ◽  
Electroplating Process

Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13×13 area-array Sn/3.0Ag solder bumps of 70 μm in height and 90 μm in diameter were fabricated with a smooth and shiny surface and with a uniform distribution of Ag. During multireflow, the scalloped Cu6Sn5 phase grows by a ripening process. Volume shrinkage was the main reason for the formation of microvoids during multireflow. The average shear strength of solder bumps on TiW/Cu under bump metallurgy (UBM) increased with reflow times. The electroplating process is suitable for mass production of well-controlled geometry and uniformity of SnAg solder bumps. Microvoids have trivial negative impacts on the solder bonds. The combination of TiW/Cu UBM and SnAg solder is reliable.

Sign in / Sign up

Export Citation Format

Share Document