Investigation of the thermal stability of Cu nanowires using atomistic simulations

2014 ◽  
Vol 115 (21) ◽  
pp. 213518 ◽  
Author(s):  
F. Granberg ◽  
S. Parviainen ◽  
F. Djurabekova ◽  
K. Nordlund
Keyword(s):  
Thermal Stability ◽  
Atomistic Simulations ◽  
Cu Nanowires ◽  
Thermal Stability Of

Thermal stability of Cu nanowires on a sapphire substrate

2008 ◽  
Vol 103 (2) ◽  
pp. 024315 ◽  
Author(s):  
Hongwei Li ◽  
Jeffrey M. Biser ◽  
Jason T. Perkins ◽  
Sreya Dutta ◽  
Richard P. Vinci ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Sapphire Substrate ◽  
Cu Nanowires ◽  
Thermal Stability Of

Tunable thermodynamic stability of Au–CuPt core–shell trimetallic nanoparticles by controlling the alloy composition: insights from atomistic simulations

2014 ◽  
Vol 16 (41) ◽  
pp. 22754-22761 ◽  
Author(s):  
Rao Huang ◽  
Gui-Fang Shao ◽  
Yu-Hua Wen ◽  
Shi-Gang Sun
Keyword(s):  
Thermal Stability ◽  
Thermodynamic Stability ◽  
Alloy Composition ◽  
Atomistic Simulations ◽  
Core Shell ◽  
Shell Nanoparticles ◽  
Metallic Core ◽  
Core Shell Nanoparticles ◽  
Thermal Stability Of

A microscopic understanding of the thermal stability of metallic core–shell nanoparticles is of importance for their synthesis and ultimately application in catalysis.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Practical criteria for the thermal stability of a unidimensional superconductor

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of
Sign in / Sign up

Export Citation Format

Share Document